SLAS520E February   2007  – December 2014 TLV320AIC3101

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Simplified Diagram
  5. 5 Revision History
  6. 6 Description (continued)
  7. 7 Device Comparison Table
  8. 8 Pin Configuration and Functions
  9. 9 Specifications
    1. 9.1 Absolute Maximum Ratings
    2. 9.2 ESD Ratings
    3. 9.3 Recommended Operating Conditions
    4. 9.4 Thermal Information
    5. 9.5 Electrical Characteristics
    6. 9.6 Timing Requirements: Audio Data Serial Interface
    7. 9.7 Typical Characteristics
  10. 10Parameter Measurement Information
  11. 11Detailed Description
    1. 11.1 Overview
    2. 11.2 Functional Block Diagram
    3. 11.3 Feature Description
      1. 11.3.1  Hardware Reset
      2. 11.3.2  Digital Audio Data Serial Interface
        1. 11.3.2.1 Right-Justified Mode
        2. 11.3.2.2 Left-Justified Mode
        3. 11.3.2.3 I2S Mode
        4. 11.3.2.4 DSP Mode
        5. 11.3.2.5 TDM Data Transfer
      3. 11.3.3  Audio Data Converters
        1. 11.3.3.1 Audio Clock Generation
        2. 11.3.3.2 Stereo Audio ADC
          1. 11.3.3.2.1 Stereo Audio ADC High-Pass Filter
          2. 11.3.3.2.2 Automatic Gain Control (AGC)
            1. 11.3.3.2.2.1 Target Level
            2. 11.3.3.2.2.2 Attack Time
            3. 11.3.3.2.2.3 Decay Time
            4. 11.3.3.2.2.4 Noise Gate Threshold
            5. 11.3.3.2.2.5 Maximum PGA Gain Applicable
        3. 11.3.3.3 Stereo Audio DAC
          1. 11.3.3.3.1 Digital Audio Processing for Playback
          2. 11.3.3.3.2 Digital Interpolation Filter
          3. 11.3.3.3.3 Audio DAC Digital Volume Control
          4. 11.3.3.3.4 Increasing DAC Dynamic Range
          5. 11.3.3.3.5 Analog Output Common-Mode Adjustment
          6. 11.3.3.3.6 Audio DAC Power Control
      4. 11.3.4  Audio Analog Inputs
      5. 11.3.5  Analog Fully Differential Line Output Drivers
      6. 11.3.6  Analog High-Power Output Drivers
      7. 11.3.7  Input Impedance and VCM Control
      8. 11.3.8  MICBIAS Generation
      9. 11.3.9  Short-Circuit Output Protection
      10. 11.3.10 Jack/Headset Detection
    4. 11.4 Device Functional Modes
      1. 11.4.1 Bypass Path Mode
        1. 11.4.1.1 Analog Input Bypass Path Functionality
        2. 11.4.1.2 ADC PGA Signal Bypass Path Functionality
        3. 11.4.1.3 Passive Analog Bypass During Power Down
      2. 11.4.2 Digital Audio Processing for Record Path
    5. 11.5 Programming
      1. 11.5.1 I2C Control Interface
      2. 11.5.2 I2C Bus Debug in a Glitched System
    6. 11.6 Register Maps
    7. 11.7 Output Stage Volume Controls
  12. 12Application and Implementation
    1. 12.1 Application Information
    2. 12.2 Typical Application
      1. 12.2.1 AC-Coupled Headphone Output With Separate Line Outputs and External Speaker Amplifier
        1. 12.2.1.1 Design Requirements
        2. 12.2.1.2 Detailed Design Procedure
        3. 12.2.1.3 Application Curves
      2. 12.2.2 Connections With Headphone and External Speaker Driver in Cell Phone Application
        1. 12.2.2.1 Design Requirements
        2. 12.2.2.2 Detailed Design Procedure
        3. 12.2.2.3 Application Curves
  13. 13Power Supply Recommendations
  14. 14Layout
    1. 14.1 Layout Guidelines
    2. 14.2 Layout Example
  15. 15Device and Documentation Support
    1. 15.1 Trademarks
    2. 15.2 Electrostatic Discharge Caution
    3. 15.3 Glossary
  16. 16Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

15 Device and Documentation Support

15.1 Trademarks

All other trademarks are the property of their respective owners.

15.2 Electrostatic Discharge Caution

esds-image

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

15.3 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.