SLAS715D
June 2010 – October 2024
TLV320AIC3104-Q1
PRODUCTION DATA
1
1
Features
2
Applications
3
Description
4
Device Comparison
5
Pin Configuration and Functions
6
Specifications
6.1
Absolute Maximum Ratings
6.2
ESD Ratings
6.3
Recommended Operating Conditions
6.4
Thermal Information
6.5
Electrical Characteristics
6.6
Switching Characteristics I2S/LJF/RJF Timing in Master Mode
6.7
Switching Characteristics I2S/LJF/RJF Timing in Slave Mode
6.8
Switching Characteristics DSP Timing in Master Mode
6.9
Switching Characteristics DSP Timing in Slave Mode
6.10
Typical Characteristics
7
Detailed Description
7.1
Overview
7.2
Functional Block Diagram
7.3
Feature Description
7.3.1
Audio Data Converters
7.3.2
Stereo Audio ADC
7.3.2.1
Stereo Audio ADC High-Pass Filter
7.3.3
Automatic Gain Control (AGC)
7.3.4
Stereo Audio DAC
7.3.5
Digital Audio Processing for Playback
7.3.6
Digital Interpolation Filter
7.3.7
Delta-Sigma Audio DAC
7.3.8
Audio DAC Digital Volume Control
7.3.9
Analog Output Common-mode Adjustment
7.3.10
Audio DAC Power Control
7.3.11
Audio Analog Inputs
7.3.12
Analog Input Bypass Path Functionality
7.3.13
ADC PGA Signal Bypass Path Functionality
7.3.14
Input Impedance and VCM Control
7.3.15
MICBIAS Generation
7.3.16
Analog Fully Differential Line Output Drivers
7.3.17
Analog High-Power Output Drivers
7.3.18
Short-Circuit Output Protection
7.3.19
Jack and Headset Detection
7.4
Device Functional Modes
7.4.1
Digital Audio Processing for Record Path
7.4.2
Increasing DAC Dynamic Range
7.4.3
Passive Analog Bypass During Power Down
7.4.4
Hardware Reset
7.5
Programming
7.5.1
Digital Control Serial Interface
7.5.2
I2C Control Interface
7.5.3
I2C Bus Debug in a Glitched System
7.5.4
Digital Audio Data Serial Interface
7.5.5
Right-Justified Mode
7.5.6
Left-Justified Mode
7.5.7
I2S Mode
7.5.8
DSP Mode
7.5.9
TDM Data Transfer
7.5.10
Audio Clock Generation
8
Register Maps
8.1
Output Stage Volume Controls
9
Application and Implementation
9.1
Application Information
9.2
Typical Applications
9.2.1
External Speaker Driver in Infotainment and Cluster Applications
9.2.1.1
Design Requirements
9.2.1.2
Detailed Design Procedure
9.2.1.3
Application Curves
9.2.2
External Speaker Amplifier With Separate Line Outputs
9.2.2.1
Design Requirements
9.2.2.2
Detailed Design Procedure
9.3
Power Supply Recommendations
9.4
Layout
9.4.1
Layout Guidelines
9.4.2
Layout Example
10
Device and Documentation Support
10.1
Device Support
10.1.1
Device Nomenclature
10.2
Documentation Support
10.2.1
Related Documentation
10.3
Receiving Notification of Documentation Updates
10.4
Community Resources
10.5
Trademarks
10.6
Electrostatic Discharge Caution
11
Revision History
12
Mechanical, Packaging, and Orderable Information
Package Options
Mechanical Data (Package|Pins)
RHB|32
MPQF130D
Thermal pad, mechanical data (Package|Pins)
RHB|32
QFND029X
Orderable Information
slas715d_oa
slas715d_pm
9.4.2
Layout Example
Figure 9-7
Layout Example