SLAS510G March   2007  – February 2021 TLV320AIC3104

PRODUCTION DATA  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Description (Continued)
  6. Device Comparison Table
  7. Pin Configuration and Functions
  8. Specifications
    1. 8.1 Absolute Maximum Ratings
    2. 8.2 ESD Ratings
    3. 8.3 Recommended Operating Conditions
    4. 8.4 Thermal Information
    5. 8.5 Electrical Characteristics
    6. 8.6 Audio Data Serial Interface Timing Requirements
    7. 8.7 Timing Diagrams
    8. 8.8 Typical Characteristics
  9. Parameter Measurement Information
  10. 10Detailed Description
    1. 10.1 Overview
    2. 10.2 Functional Block Diagrams
    3. 10.3 Feature Description
      1. 10.3.1  Hardware Reset
      2. 10.3.2  Digital Audio Data Serial Interface
        1. 10.3.2.1 Right-Justified Mode
        2. 10.3.2.2 Left-Justified Mode
        3. 10.3.2.3 I2S Mode
        4. 10.3.2.4 DSP Mode
        5. 10.3.2.5 TDM Data Transfer
      3. 10.3.3  Audio Data Converters
        1. 10.3.3.1 Audio Clock Generation
        2. 10.3.3.2 Stereo Audio ADC
          1. 10.3.3.2.1 Stereo Audio ADC High-Pass Filter
          2. 10.3.3.2.2 Automatic Gain Control (AGC)
            1. 10.3.3.2.2.1 Target Level
            2. 10.3.3.2.2.2 Attack Time
            3. 10.3.3.2.2.3 Decay Time
            4. 10.3.3.2.2.4 Noise Gate Threshold
            5. 10.3.3.2.2.5 Maximum PGA Gain Applicable
      4. 10.3.4  Stereo Audio DAC
        1. 10.3.4.1 Digital Audio Processing for Playback
        2. 10.3.4.2 Digital Interpolation Filter
        3. 10.3.4.3 Delta-Sigma Audio DAC
        4. 10.3.4.4 Audio DAC Digital Volume Control
        5. 10.3.4.5 Increasing DAC Dynamic Range
        6. 10.3.4.6 Analog Output Common-Mode Adjustment
        7. 10.3.4.7 Audio DAC Power Control
      5. 10.3.5  Audio Analog Inputs
      6. 10.3.6  Analog Fully Differential Line Output Drivers
      7. 10.3.7  Analog High-Power Output Drivers
      8. 10.3.8  Input Impedance and VCM Control
      9. 10.3.9  MICBIAS Generation
      10. 10.3.10 Short-Circuit Output Protection
      11. 10.3.11 Jack and Headset Detection
    4. 10.4 Device Functional Modes
      1. 10.4.1 Bypass Path Mode
        1. 10.4.1.1 ADC PGA Signal Bypass Path Functionality
        2. 10.4.1.2 Passive Analog Bypass During Power Down
      2. 10.4.2 Digital Audio Processing for Record Path
    5. 10.5 Programming
      1. 10.5.1 I2C Control Interface
        1. 10.5.1.1 I2C Bus Debug in a Glitched System
      2. 10.5.2 Register Map Structure
    6. 10.6 Register Maps
      1. 10.6.1 Output Stage Volume Controls
  11. 11Application and Implementation
    1. 11.1 Application Information
    2. 11.2 Typical Applications
      1. 11.2.1 Typical Connections With Headphone and External Speaker Driver in Portable Application
        1. 11.2.1.1 Design Requirements
        2. 11.2.1.2 Detailed Design Procedure
        3. 11.2.1.3 Application Curves
      2. 11.2.2 Typical Connections for AC-Coupled Headphone Output With Separate Line Outputs and External Speaker Amplifier
        1. 11.2.2.1 Design Requirements
        2. 11.2.2.2 Detailed Design Procedure
        3. 11.2.2.3 Application Curves
  12. 12Power Supply Recommendations
  13. 13Layout
    1. 13.1 Layout Guidelines
    2. 13.2 Layout Example
  14. 14Device and Documentation Support
    1. 14.1 Receiving Notification of Documentation Updates
    2. 14.2 Support Resources
    3. 14.3 Trademarks
    4. 14.4 Electrostatic Discharge Caution
    5. 14.5 Glossary

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • RHB|32
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Pin Configuration and Functions

GUID-E677FFAC-6F0F-4E61-8604-FC60C156DD76-low.gif
NOTE: Connect device thermal pad to DRVSS.
Figure 7-1 RHB Package,32-Pin (VQFN),Bottom View
Table 7-1 Pin Functions
PIN I/O DESCRIPTION
NAME NO.
AVDD 25 Analog DAC voltage supply, 2.7 V–3.6 V
AVSS1 17 Analog ADC ground supply, 0 V
AVSS2 26 Analog DAC ground supply, 0 V
BCLK 2 I/O Audio serial data bus bit clock input/output
DIN 4 I Audio serial data bus data input
DOUT 5 O Audio serial data bus data output
DRVDD 18 Analog ADC and output driver voltage supply, 2.7 V–3.6 V
DRVDD 24 Analog output driver voltage supply, 2.7 V–3.6 V
DRVSS 21 Analog output driver ground supply, 0 V
DVDD 32 Digital core voltage supply, 1.525 V–1.95 V
DVSS 6 Digital core, I/O ground supply, 0 V
HPLCOM 20 O High-power output driver (left – or multi-functional)
HPLOUT 19 O High-power output driver (left +)
HPRCOM 22 O High-power output driver (right – or multi-functional)
HPROUT 23 O High-power output driver (right +)
IOVDD 7 Digital I/O voltage supply, 1.1 V–3.6 V
LEFT_LOM 28 O Left line output (–)
LEFT_LOP 27 O Left line output (+)
MCLK 1 I Master clock input
MIC1LM/LINE1LM 11 I Left input – (diff only)
MIC1LP/LINE1LP 10 I Left input 1 (SE) or left input + (diff)
MIC1RM/LINE1RM 13 I Right input – (diff only)
MIC1RP/LINE1RP 12 I Right input 1 (SE) or right input + (diff)
MIC2L/LINE2L/MICDET 14 I Left input 2 (SE); can support microphone detection
MIC2R/LINE2R 16 I Right input 2 (SE)
MICBIAS 15 O Microphone bias voltage output
RESET 31 I Reset
RIGHT_LOM 30 O Right line output (–)
RIGHT_LOP 29 O Right line output (+)
SCL 8 I/O I2C serial clock input
SDA 9 I/O I2C serial data input/output
WCLK 3 I/O Audio serial data bus word clock input/output