SLAS663C August   2009  – June 2016 TLV320AIC3106-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Description (Continued)
  6. 6 Device Comparison Table
  7. 7 Pin Configuration and Functions
  8. 8 Specifications
    1. 8.1  Absolute Maximum Ratings
    2. 8.2  ESD Ratings
    3. 8.3  Recommended Operating Conditions
    4. 8.4  Thermal Information
    5. 8.5  Electrical Characteristics
    6. 8.6  Switching Characteristics I2S/LJF/RJF In Master Mode
    7. 8.7  Switching Characteristics I2S/LJF/RJF In Slave Mode
    8. 8.8  Switching Characteristics DSP In Master Mode
    9. 8.9  Switching Characteristics DSP In Slave Mode
    10. 8.10 Typical Characteristics
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1  Audio Data Converters
      2. 9.3.2  Stereo Audio ADC
        1. 9.3.2.1 Stereo Audio ADC High-Pass Filter
      3. 9.3.3  Automatic Gain Control (AGC)
      4. 9.3.4  Stereo Audio DAC
      5. 9.3.5  Digital Audio Processing For Playback
      6. 9.3.6  Digital Interpolation Filter
      7. 9.3.7  Delta-Sigma Audio Dac
      8. 9.3.8  Audio Dac Digital Volume Control
      9. 9.3.9  Analog Output Common-Mode Adjustment
      10. 9.3.10 Audio DAC Power Control
      11. 9.3.11 Audio Analog Inputs
      12. 9.3.12 Analog Input Bypass Path Functionality
      13. 9.3.13 ADC PGA Signal Bypass Path Functionality
      14. 9.3.14 Input Impedance and VCM Control
      15. 9.3.15 MICBIAS Generation
      16. 9.3.16 Analog Fully Differential Line Output Drivers
      17. 9.3.17 Analog High Power Output Drivers
      18. 9.3.18 Short Circuit Output Protection
      19. 9.3.19 Jack and Headset Detection
      20. 9.3.20 General-Purpose I/O
    4. 9.4 Device Functional Modes
      1. 9.4.1 Digital Audio Processing For Record Path
      2. 9.4.2 Increasing DAC Dynamic Range
      3. 9.4.3 Passive Analog Bypass During Powerdown
      4. 9.4.4 Digital Microphone Connectivity
    5. 9.5 Programming
      1. 9.5.1  Hardware Reset
      2. 9.5.2  Digital Control Serial Interface
        1. 9.5.2.1 SPI Control Mode
        2. 9.5.2.2 SPI Communication Protocol
          1. 9.5.2.2.1 Limitation On Register Writing
        3. 9.5.2.3 Continuous Read and Write Operation
      3. 9.5.3  I2C Control Mode
      4. 9.5.4  I2C Bus Debug In A Glitched System
      5. 9.5.5  Digital Audio Data Serial Interface
      6. 9.5.6  Right-Justified Mode
      7. 9.5.7  Left-Justified Mode
      8. 9.5.8  I2S Mode
      9. 9.5.9  DSP Mode
      10. 9.5.10 TDM Data Transfer
      11. 9.5.11 Audio Clock Generation
    6. 9.6 Register Maps
      1. 9.6.1 Output Stage Volume Controls
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
      3. 10.2.3 Application Curves
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Receiving Notification of Documentation Updates
    2. 13.2 Community Resources
    3. 13.3 Trademarks
    4. 13.4 Electrostatic Discharge Caution
    5. 13.5 Glossary
  14. 14Mechanical, Packaging, And Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

13 Device and Documentation Support

13.1 Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document.

13.2 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

13.3 Trademarks

E2E is a trademark of Texas Instruments.

All other trademarks are the property of their respective owners.

13.4 Electrostatic Discharge Caution

esds-image

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

13.5 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.