SLAS509G April   2006  – July 2021 TLV320AIC3106

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Description (continued)
  6. 6 Device Comparison Table
  7. 7 Pin Configuration and Functions
  8. 8 Specifications
    1. 8.1 Absolute Maximum Ratings
    2. 8.2 ESD Ratings
    3. 8.3 Recommended Operating Conditions
    4. 8.4 Thermal Information
    5. 8.5 Electrical Characteristics
    6. 8.6 Timing Requirements: Audio Data Serial Interface (1)
    7. 8.7 Timing Diagrams
    8. 8.8 Typical Characteristics
  9. 9 Parameter Measurement Information
  10. 10Detailed Description
    1. 10.1 Overview
    2. 10.2 Functional Block Diagram
    3. 10.3 Feature Description
      1. 10.3.1  Hardware Reset
      2. 10.3.2  Digital Audio Data Serial Interface
        1. 10.3.2.1 Right-Justified Mode
        2. 10.3.2.2 Left-Justified Mode
        3. 10.3.2.3 I2S Mode
        4. 10.3.2.4 DSP Mode
        5. 10.3.2.5 TDM Data Transfer
      3. 10.3.3  Audio Data Converters
        1. 10.3.3.1 Audio Clock Generation
        2. 10.3.3.2 Stereo Audio ADC
          1. 10.3.3.2.1 Stereo Audio ADC High-Pass Filter
          2. 10.3.3.2.2 Automatic Gain Control (AGC)
            1. 10.3.3.2.2.1 Target Level
            2. 10.3.3.2.2.2 Attack Time
            3. 10.3.3.2.2.3 Decay Time
            4. 10.3.3.2.2.4 Noise Gate Threshold
            5. 10.3.3.2.2.5 Maximum PGA Gain Applicable
        3. 10.3.3.3 Stereo Audio DAC
          1. 10.3.3.3.1 Digital Audio Processing for Playback
          2. 10.3.3.3.2 Digital Interpolation Filter
          3. 10.3.3.3.3 Delta-Sigma Audio DAC
          4. 10.3.3.3.4 Audio DAC Digital Volume Control
          5. 10.3.3.3.5 Increasing DAC Dynamic Range
          6. 10.3.3.3.6 Analog Output Common-Mode Adjustment
          7. 10.3.3.3.7 Audio DAC Power Control
      4. 10.3.4  Audio Analog Inputs
      5. 10.3.5  Analog Fully Differential Line Output Drivers
      6. 10.3.6  Analog High Power Output Drivers
      7. 10.3.7  Input Impedance and VCM Control
      8. 10.3.8  General-Purpose I/O
      9. 10.3.9  Digital Microphone Connectivity
      10. 10.3.10 Micbias Generation
      11. 10.3.11 Short Circuit Output Protection
      12. 10.3.12 Jack/Headset Detection
    4. 10.4 Device Functional Modes
      1. 10.4.1 Bypass Path Mode
        1. 10.4.1.1 Analog Input Bypass Path Functionality
        2. 10.4.1.2 ADC PGA Signal Bypass Path Functionality
        3. 10.4.1.3 Passive Analog Bypass During Powerdown
      2. 10.4.2 Digital Audio Processing for Record Path
    5. 10.5 Programming
      1. 10.5.1 Digital Control Serial Interface
        1. 10.5.1.1 SPI Control Mode
          1. 10.5.1.1.1 SPI Communication Protocol
          2. 10.5.1.1.2 Limitation on Register Writing
          3. 10.5.1.1.3 Continuous Read / Write Operation
        2. 10.5.1.2 I2C Control Interface
          1. 10.5.1.2.1 I2C BUS Debug in a Glitched System
    6. 10.6 Register Maps
      1. 10.6.1 Output Stage Volume Controls
  11. 11Application and Implementation
    1. 11.1 Application Information
    2. 11.2 Typical Application
      1. 11.2.1 Design Requirements
      2. 11.2.2 Detailed Design Procedure
      3. 11.2.3 Application Curves
  12. 12Power Supply Recommendations
  13. 13Layout
    1. 13.1 Layout Guidelines
    2. 13.2 Layout Examples
  14. 14Device and Documentation Support
    1. 14.1 Receiving Notification of Documentation Updates
    2. 14.2 Support Resources
    3. 14.3 Trademarks
    4. 14.4 Electrostatic Discharge Caution
    5. 14.5 Glossary

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

10.4.1.3 Passive Analog Bypass During Powerdown

Programming the TLV320AIC3106 to Passive Analog bypass occurs by configuring the output stage switches for pass through. This is done by opening switches SW-L0, SW-L3, SW-R0, SW-R3 and closing either SW-L1 or SW-L2 and SW-R1 or SW-R2. See Figure 10-20 Passive Analog Bypass Mode Configuration. Programming this mode is done by writing to Page 0, Register 108.

Connecting MIC1LP/LINE1LP input signal to the LEFT_LOP pin is done by closing SW-L1 and opening SW-L0, this action is done by writing a “1” to Page 0, Register 108, Bit D0. Connecting MIC2LP/LINE2LP input signal to the LEFT_LOP pin is done by closing SW-L2 and opening SW-L0, this action is done by writing a “1” to Page 0, Register 108, Bit D2. Connecting MIC1LM/LINE1LM input signal to the LEFT_LOM pin is done by closing SW-L4 and opening SW-L3, this action is done by writing a “1” to Page 0, Register 108, Bit D1. Connecting MIC2LM/LINE2LM input signal to the LEFT_LOM pin is done by closing SW-L5 and opening SW-L3, this action is done by writing a “1” to Page 0, Register 108, Bit D3.

Connecting MIC1RP/LINE1RP input signal to the RIGHT_LOP pin is done by closing SW-R1 and opening SW-R0, this action is done by writing a “1” to Page 0, Register 108, Bit D4. Connecting MIC2RP/LINE2RP input signal to the RIGHT_LOP pin is done by closing SW-R2 and opening SW-R0, this action is done by writing a “1” to Page 0, Register 108, Bit D6. Connecting MIC1RM/LINE1RM input signal to the RIGHT_LOM pin is done by closing SW-R4 and opening SW-R3, this action is done by writing a “1” to Page 0, Register 108, Bit D5. Connecting MIC2RM/LINE2RM input signal to the RIGHT_LOM pin is done by closing SW-R5 and opening SW-R3, this action is done by writing a “1” to Page 0, Register 108, Bit D7. A diagram of the passive analog bypass mode configuration can be seen in Figure 10-20.

In general, connecting two switches to the same output pin should be avoided, as this error will short two input signals together, and would like cause distortion of the signal as the two signal are in contention, and poor frequency response would also likely occur.

GUID-5E9A9BCB-173C-4B05-8F4E-CDD4FCC1A918-low.gifFigure 10-20 Passive Analog Bypass Mode Configuration