SLAS509G April   2006  – July 2021 TLV320AIC3106

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Description (continued)
  6. 6 Device Comparison Table
  7. 7 Pin Configuration and Functions
  8. 8 Specifications
    1. 8.1 Absolute Maximum Ratings
    2. 8.2 ESD Ratings
    3. 8.3 Recommended Operating Conditions
    4. 8.4 Thermal Information
    5. 8.5 Electrical Characteristics
    6. 8.6 Timing Requirements: Audio Data Serial Interface (1)
    7. 8.7 Timing Diagrams
    8. 8.8 Typical Characteristics
  9. 9 Parameter Measurement Information
  10. 10Detailed Description
    1. 10.1 Overview
    2. 10.2 Functional Block Diagram
    3. 10.3 Feature Description
      1. 10.3.1  Hardware Reset
      2. 10.3.2  Digital Audio Data Serial Interface
        1. 10.3.2.1 Right-Justified Mode
        2. 10.3.2.2 Left-Justified Mode
        3. 10.3.2.3 I2S Mode
        4. 10.3.2.4 DSP Mode
        5. 10.3.2.5 TDM Data Transfer
      3. 10.3.3  Audio Data Converters
        1. 10.3.3.1 Audio Clock Generation
        2. 10.3.3.2 Stereo Audio ADC
          1. 10.3.3.2.1 Stereo Audio ADC High-Pass Filter
          2. 10.3.3.2.2 Automatic Gain Control (AGC)
            1. 10.3.3.2.2.1 Target Level
            2. 10.3.3.2.2.2 Attack Time
            3. 10.3.3.2.2.3 Decay Time
            4. 10.3.3.2.2.4 Noise Gate Threshold
            5. 10.3.3.2.2.5 Maximum PGA Gain Applicable
        3. 10.3.3.3 Stereo Audio DAC
          1. 10.3.3.3.1 Digital Audio Processing for Playback
          2. 10.3.3.3.2 Digital Interpolation Filter
          3. 10.3.3.3.3 Delta-Sigma Audio DAC
          4. 10.3.3.3.4 Audio DAC Digital Volume Control
          5. 10.3.3.3.5 Increasing DAC Dynamic Range
          6. 10.3.3.3.6 Analog Output Common-Mode Adjustment
          7. 10.3.3.3.7 Audio DAC Power Control
      4. 10.3.4  Audio Analog Inputs
      5. 10.3.5  Analog Fully Differential Line Output Drivers
      6. 10.3.6  Analog High Power Output Drivers
      7. 10.3.7  Input Impedance and VCM Control
      8. 10.3.8  General-Purpose I/O
      9. 10.3.9  Digital Microphone Connectivity
      10. 10.3.10 Micbias Generation
      11. 10.3.11 Short Circuit Output Protection
      12. 10.3.12 Jack/Headset Detection
    4. 10.4 Device Functional Modes
      1. 10.4.1 Bypass Path Mode
        1. 10.4.1.1 Analog Input Bypass Path Functionality
        2. 10.4.1.2 ADC PGA Signal Bypass Path Functionality
        3. 10.4.1.3 Passive Analog Bypass During Powerdown
      2. 10.4.2 Digital Audio Processing for Record Path
    5. 10.5 Programming
      1. 10.5.1 Digital Control Serial Interface
        1. 10.5.1.1 SPI Control Mode
          1. 10.5.1.1.1 SPI Communication Protocol
          2. 10.5.1.1.2 Limitation on Register Writing
          3. 10.5.1.1.3 Continuous Read / Write Operation
        2. 10.5.1.2 I2C Control Interface
          1. 10.5.1.2.1 I2C BUS Debug in a Glitched System
    6. 10.6 Register Maps
      1. 10.6.1 Output Stage Volume Controls
  11. 11Application and Implementation
    1. 11.1 Application Information
    2. 11.2 Typical Application
      1. 11.2.1 Design Requirements
      2. 11.2.2 Detailed Design Procedure
      3. 11.2.3 Application Curves
  12. 12Power Supply Recommendations
  13. 13Layout
    1. 13.1 Layout Guidelines
    2. 13.2 Layout Examples
  14. 14Device and Documentation Support
    1. 14.1 Receiving Notification of Documentation Updates
    2. 14.2 Support Resources
    3. 14.3 Trademarks
    4. 14.4 Electrostatic Discharge Caution
    5. 14.5 Glossary

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.6 Timing Requirements: Audio Data Serial Interface(1)

PARAMETERIOVDD = 1.1 VIOVDD = 3.3 VUNIT
MINMAXMINMAX
I2S/LJF/RJF Timing in Master Mode
td(WS)ADWS/WCLK delay time5015ns
td(DO-WS)ADWS/WCLK to DOUT delay time5020ns
td(DO-BCLK)BCLK to DOUT delay time5015ns
ts(DI)DIN setup time106ns
th(DI)DIN hold time106ns
trRise time3010ns
tfFall time3010ns
DSP Timing in Master Mode
td(WS)ADWS/WCLK delay time5015ns
td(DO-BCLK)BCLK to DOUT delay time5015ns
ts(DI)DIN setup time106ns
th(DI)DIN hold time106ns
trRise time3010ns
tfFall time3010ns
I2S/LJF/RJF Timing in Slave Mode
tH(BCLK)BCLK high period7035ns
tL(BCLK)BCLK low period7035ns
ts(WS)ADWS/WCLK setup time106ns
th(WS)ADWS/WCLK hold time106ns
td(DO-WS)ADWS/WCLK to DOUT delay time (for LJF Mode only)5035ns
td(DO-BCLK)BCLK to DOUT delay time5020ns
ts(DI)DIN setup time106ns
th(DI)DIN hold time106ns
trRise time84ns
tfFall time84ns
DSP Timing in Slave Mode
tH(BCLK)BCLK high period7035ns
tL(BCLK)BCLK low period7035ns
ts(WS)ADWS/WCLK setup time108ns
th(WS)ADWS/WCLK hold time108ns
td(DO-BCLK)BCLK to DOUT delay time5020ns
ts(DI)DIN setup time106ns
th(DI)DIN hold time106ns
trRise time84ns
tfFall time84ns
(1) All timing specifications are measured at characterization but not tested at final test.