SLAS653C February   2010  – February 2017 TLV320AIC3120

PRODUCTION DATA.  

  1. 1 Device Overview
    1. 1.1 Features
    2. 1.2 Applications
    3. 1.3 Description
    4. 1.4 Functional Block Diagram
  2. 2 Revision History
  3. 3  Device Comparison
  4. 4 Pin Configuration and Functions
    1. 4.1 Pin Attributes
  5. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics
    6. 5.6  Power Dissipation Ratings
    7. 5.7  I2S, LJF, and RJF Timing in Master Mode
    8. 5.8  I2S, LJF, and RJF Timing in Slave Mode
    9. 5.9  DSP Timing in Master Mode
    10. 5.10 DSP Timing in Slave Mode
    11. 5.11 I2C Interface Timing
    12. 5.12 Typical Characteristics
      1. 5.12.1 Audio ADC Performance
      2. 5.12.2 DAC Performance
      3. 5.12.3 Class-D Speaker Driver Performance
      4. 5.12.4 Analog Bypass Performance H
      5. 5.12.5 MICBIAS Performance H
  6. 6 Parameter Measurement Information
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Power-Supply Sequence
      2. 7.3.2  Reset
      3. 7.3.3  Device Start-Up Lockout Times
      4. 7.3.4  PLL Start-Up
      5. 7.3.5  Power-Stage Reset
      6. 7.3.6  Software Power Down
      7. 7.3.7  Audio Analog I/O
      8. 7.3.8  miniDSP
        1. 7.3.8.1 Software
      9. 7.3.9  Digital Processing Low-Power Modes
        1. 7.3.9.1 ADC, Mono, 48 kHz, DVDD = 1.8 V, AVDD = 3.3 V
        2. 7.3.9.2 ADC, Mono, 8 kHz, DVDD = 1.8 V, AVDD = 3.3 V
        3. 7.3.9.3 DAC Playback on Headphones, Mono, 48 kHz, DVDD = 1.8 V, AVDD = 3.3 V, HPVDD = 3.3 V
        4. 7.3.9.4 DAC Playback on Headphones, Mono, 8 kHz, DVDD = 1.8 V, AVDD = 3.3 V, HPVDD = 3.3 V
      10. 7.3.10 Audio ADC and Analog Inputs
        1. 7.3.10.1 MICBIAS and Microphone Preamplifier
        2. 7.3.10.2 Automatic Gain Control (AGC)
        3. 7.3.10.3 Delta-Sigma ADC
        4. 7.3.10.4 ADC Decimation Filtering and Signal Processing
          1. 7.3.10.4.1 ADC Processing Blocks
          2. 7.3.10.4.2 ADC Processing Blocks - Signal Chain Details
            1. 7.3.10.4.2.1 First-Order IIR, AGC, Filter A
            2. 7.3.10.4.2.2 Five Biquads, First-Order IIR, AGC, Filter A
            3. 7.3.10.4.2.3 25-Tap FIR, First-Order IIR, AGC, Filter A
            4. 7.3.10.4.2.4 First-Order IIR, AGC, Filter B
            5. 7.3.10.4.2.5 Three Biquads, First-Order IIR, AGC, Filter B
            6. 7.3.10.4.2.6 20-Tap FIR, First-Order IIR, AGC, Filter B
            7. 7.3.10.4.2.7 First-Order IIR, AGC, Filter C
            8. 7.3.10.4.2.8 Five Biquads, First-Order IIR, AGC, Filter C
            9. 7.3.10.4.2.9 25-Tap FIR, First-Order IIR, AGC, Filter C
          3. 7.3.10.4.3 User-Programmable Filters
            1. 7.3.10.4.3.1 First-Order IIR Section
            2. 7.3.10.4.3.2 Biquad Section
            3. 7.3.10.4.3.3 FIR Section
          4. 7.3.10.4.4 ADC Digital Decimation Filter Characteristics
            1. 7.3.10.4.4.1 Decimation Filter A
            2. 7.3.10.4.4.2 Decimation Filter B
            3. 7.3.10.4.4.3 Decimation Filter C
          5. 7.3.10.4.5 ADC Data Interface
        5. 7.3.10.5 Updating ADC Digital Filter Coefficients During Record
        6. 7.3.10.6 Digital Microphone Function
        7. 7.3.10.7 DC Measurement
        8. 7.3.10.8 ADC Setup
      11. 7.3.11 Example Register Setup to Record Analog Data Through ADC to Digital Out
      12. 7.3.12 Audio DAC and Audio Analog Outputs
        1. 7.3.12.1  DAC
          1. 7.3.12.1.1 DAC Processing Blocks
          2. 7.3.12.1.2 DAC Processing Blocks — Signal Chain Details
            1. 7.3.12.1.2.1 Three Biquads, Filter A
            2. 7.3.12.1.2.2 Six Biquads, First-Order IIR, DRC, Filter A or B
            3. 7.3.12.1.2.3 Six Biquads, First-Order IIR, Filter A or B
            4. 7.3.12.1.2.4 IIR, Filter B or C
            5. 7.3.12.1.2.5 Four Biquads, DRC, Filter B
            6. 7.3.12.1.2.6 Four Biquads, Filter B
            7. 7.3.12.1.2.7 Four Biquads, First-Order IIR, DRC, Filter C
            8. 7.3.12.1.2.8 Four Biquads, First-Order IIR, Filter C
            9. 7.3.12.1.2.9 Five Biquads, DRC, Beep Generator, Filter A
          3. 7.3.12.1.3 DAC User-Programmable Filters
            1. 7.3.12.1.3.1 First-Order IIR Section
            2. 7.3.12.1.3.2 Biquad Section
          4. 7.3.12.1.4 DAC Interpolation Filter Characteristics
            1. 7.3.12.1.4.1 Interpolation Filter A
            2. 7.3.12.1.4.2 Interpolation Filter B
            3. 7.3.12.1.4.3 Interpolation Filter C
        2. 7.3.12.2  DAC Digital-Volume Control
        3. 7.3.12.3  Volume Control Pin
        4. 7.3.12.4  Dynamic Range Compression
          1. 7.3.12.4.1 DRC Threshold
          2. 7.3.12.4.2 DRC Hysteresis
          3. 7.3.12.4.3 DRC Hold
          4. 7.3.12.4.4 DRC Attack Rate
          5. 7.3.12.4.5 DRC Decay Rate
          6. 7.3.12.4.6 Example Setup for DRC
        5. 7.3.12.5  Headset Detection
        6. 7.3.12.6  Interrupts
        7. 7.3.12.7  Key-Click Functionality With Beep Generator (PRB_P25)
        8. 7.3.12.8  Programming DAC Digital Filter Coefficients
        9. 7.3.12.9  Updating DAC Digital Filter Coefficients During PLAY
        10. 7.3.12.10 Digital Mixing and Routing
        11. 7.3.12.11 Analog Audio Routing
          1. 7.3.12.11.1 Analog Output Volume Control
          2. 7.3.12.11.2 Headphone Analog-Output Volume Control
          3. 7.3.12.11.3 Class-D Speaker Analog Output Volume Control
        12. 7.3.12.12 Analog Outputs
          1. 7.3.12.12.1 Headphone Drivers
          2. 7.3.12.12.2 Speaker Drivers
        13. 7.3.12.13 Audio-Output Stage-Power Configurations
        14. 7.3.12.14 DAC Setup
        15. 7.3.12.15 Example Register Setup to Play Digital Data Through DAC and Headphone/Speaker Outputs
      13. 7.3.13 CLOCK Generation and PLL
        1. 7.3.13.1 PLL
      14. 7.3.14 Timer
      15. 7.3.15 Digital Audio and Control Interface
        1. 7.3.15.1 Digital Audio Interface
          1. 7.3.15.1.1 Right-Justified Mode
          2. 7.3.15.1.2 Left-Justified Mode
          3. 7.3.15.1.3 I2S Mode
          4. 7.3.15.1.4 DSP Mode
        2. 7.3.15.2 Primary and Secondary Digital Audio Interface Selection
        3. 7.3.15.3 Control Interface
          1. 7.3.15.3.1 I2C Control Mode
    4. 7.4 Register Map
      1. 7.4.1 TLV320AIC3120 Register Map
      2. 7.4.2 Registers
        1. 7.4.2.1  Control Registers, Page 0 (Default Page): Clock Multipliers, Dividers, Serial Interfaces, Flags, Interrupts, and GPIOs
        2. 7.4.2.2  Control Registers, Page 1: DAC and ADC Routing, PGA, Power-Controls, and MISC Logic-Related Programmability
        3. 7.4.2.3  Control Registers, Page 3: MCLK Divider for Programmable Delay Timer
        4. 7.4.2.4  Control Registers, Page 4: ADC Digital Filter Coefficients
        5. 7.4.2.5  Control Registers, Page 5: ADC Programmable Coefficients RAM (65:127)
        6. 7.4.2.6  Control Registers, Page 8: DAC Programmable Coefficients RAM Buffer A (1:63)
        7. 7.4.2.7  Control Registers, Page 9: DAC Programmable Coefficients RAM Buffer A (65:127)
        8. 7.4.2.8  Control Registers, Page 10: DAC Programmable Coefficients RAM Buffer A (129:191)
        9. 7.4.2.9  Control Registers, Page 11: DAC Programmable Coefficients RAM Buffer A (193:255)
        10. 7.4.2.10 Control Registers, Page 12: DAC Programmable Coefficients RAM Buffer B (1:63)
        11. 7.4.2.11 Control Registers, Page 13: DAC Programmable Coefficients RAM Buffer B (65:127)
        12. 7.4.2.12 Control Registers, Page 14: DAC Programmable Coefficients RAM Buffer B (129:191)
        13. 7.4.2.13 Control Registers, Page 15: DAC Programmable Coefficients RAM Buffer B (193:255)
        14. 7.4.2.14 Control Registers, Page 32: ADC DSP Engine Instruction RAM (0:31)
          1. 7.4.2.14.1 Page 32 / Register 5 (0x05) Through Page 32 / Register 97 (0x61)
        15. 7.4.2.15 Control Registers, Pages 33-43: ADC DSP Engine Instruction RAM (32:63) Through (352:383)
        16. 7.4.2.16 Control Registers, Page 64: DAC DSP Engine Instruction RAM (0:31)
          1. 7.4.2.16.1 Page 64 / Register 5 Through Page 64 / Register 97
        17. 7.4.2.17 Control Registers, Pages 65 to 95: DAC DSP Engine Instruction RAM (32:63) Through (992:1023)
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Receiving Notification of Documentation Updates
    2. 11.2 Community Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical Packaging and Orderable Information
    1. 12.1 Packaging Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

11 Device and Documentation Support

11.1 Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document.

11.2 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community The TI engineer-to-engineer (E2E) community was created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

11.3 Trademarks

PurePath, E2E are trademarks of Texas Instruments.

MATLAB is a trademark of The MathWorks, Inc.

All other trademarks are the property of their respective owners.

11.4 Electrostatic Discharge Caution

esds-image

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

11.5 Glossary

    TI Glossary This glossary lists and explains terms, acronyms, and definitions.