SLAS549D September   2008  – November 2014 TLV320AIC3254

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Simplified Block Diagram
  5. 5 Revision History
  6. 6 Device Comparison Table
  7. 7 Pin Configuration and Functions
  8. 8 Specifications
    1. 8.1  Absolute Maximum Ratings
    2. 8.2  Handling Ratings
    3. 8.3  Recommended Operating Conditions
    4. 8.4  Thermal Information
    5. 8.5  Electrical Characteristics, ADC
    6. 8.6  Electrical Characteristics, Bypass Outputs
    7. 8.7  Electrical Characteristics, Microphone Interface
    8. 8.8  Electrical Characteristics, Audio DAC Outputs
    9. 8.9  Electrical Characteristics, LDO
    10. 8.10 Electrical Characteristics, Misc.
    11. 8.11 Electrical Characteristics, Logic Levels
    12. 8.12 I2S LJF and RJF Timing in Master Mode (see )
    13. 8.13 I2S LJF and RJF Timing in Slave Mode (see )
    14. 8.14 DSP Timing in Master Mode (see )
    15. 8.15 DSP Timing in Slave Mode (see )
    16. 8.16 Digital Microphone PDM Timing (see )
    17. 8.17 I2C Interface Timing
    18. 8.18 SPI Interface Timing (See )
    19. 8.19 Typical Characteristics
    20. 8.20 Typical Characteristics, FFT
  9. 9 Parameter Measurement Information
  10. 10Detailed Description
    1. 10.1 Overview
    2. 10.2 Functional Block Diagram
    3. 10.3 Feature Description
      1. 10.3.1 Device Connections
        1. 10.3.1.1 Digital Pins
          1. 10.3.1.1.1 Multifunction Pins
        2. 10.3.1.2 Analog Pins
      2. 10.3.2 Analog Audio IO
        1. 10.3.2.1 Analog Low Power Bypass
        2. 10.3.2.2 ADC Bypass Using Mixer Amplifiers
        3. 10.3.2.3 Headphone Outputs
        4. 10.3.2.4 Line Outputs
      3. 10.3.3 ADC
        1. 10.3.3.1 ADC Processing
          1. 10.3.3.1.1 ADC Processing Blocks
      4. 10.3.4 DAC
        1. 10.3.4.1 DAC Processing Blocks
      5. 10.3.5 PowerTune
      6. 10.3.6 Digital Audio IO Interface
      7. 10.3.7 Clock Generation and PLL
      8. 10.3.8 Control Interfaces
        1. 10.3.8.1 I2C Control
        2. 10.3.8.2 SPI Control
    4. 10.4 Device Functional Modes
    5. 10.5 Software
    6. 10.6 Register Map
  11. 11Applications and Implementation
    1. 11.1 Application Information
    2. 11.2 Typical Application
      1. 11.2.1 Design Requirements
        1. 11.2.1.1 Reference Filtering Capacitor
        2. 11.2.1.2 MICBIAS
      2. 11.2.2 Detailed Design Procedures
        1. 11.2.2.1 Analog Input Connection
        2. 11.2.2.2 Analog Output Connection
      3. 11.2.3 Application Curves
  12. 12Power Supply Recommendations
  13. 13Layout
    1. 13.1 Layout Guidelines
    2. 13.2 Layout Example
  14. 14Device and Documentation Support
    1. 14.1 Documentation Support
      1. 14.1.1 Related Documentation
    2. 14.2 Trademarks
    3. 14.3 Electrostatic Discharge Caution
    4. 14.4 Glossary
  15. 15Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

13 Layout

13.1 Layout Guidelines

Each system design and PCB layout is unique. The layout should be carefully reviewed in the context of a specific PCB design. However, the following guidelines can optimize TLV320AIC3254 performance:

  • Connect the thermal pad to ground.
  • The decoupling capacitors for the power supplies should be placed close to the device terminals. Figure 21 shows the recommended decoupling capacitors for the TLV320AIC3254.
  • The TLV320AIC3254 internal voltage references must be filtered using external capacitors. Place the filter capacitors on REF near the device terminals for optimal performance.
  • For analog differential audio signals, the signals should be routed differentially on the PCB for better noise immunity. Avoid crossing of digital and analog signals to avoid undesirable crosstalk.

13.2 Layout Example

TLV320AIC32x4_Layout.gifFigure 26. TLV320AIC3254 Layout

Example layout views can be found in the EVM User Guide: