SLOS630C December   2010  – November 2014 TLV320AIC3256

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Simplified Block Diagram
  5. 5 Revision History
  6. 6 Device Comparison Table
  7. 7 Pin Configuration and Functions
  8. 8 Specifications
    1. 8.1  Absolute Maximum Ratings
    2. 8.2  Handling Ratings
    3. 8.3  Recommended Operating Conditions
    4. 8.4  Thermal Information
    5. 8.5  Electrical Characteristics, ADC
    6. 8.6  Electrical Characteristics, Bypass Outputs
    7. 8.7  Electrical Characteristics, Microphone Interface
    8. 8.8  Electrical Characteristics, Audio DAC Outputs
    9. 8.9  Electrical Characteristics, Misc.
    10. 8.10 Electrical Characteristics, Logic Levels
    11. 8.11 I2S/LJF/RJF Timing in Master Mode (see )
    12. 8.12 I2S/LJF/RJF Timing in Slave Mode (see )
    13. 8.13 DSP Timing in Master Mode (see )
    14. 8.14 DSP Timing in Slave Mode (see )
    15. 8.15 Digital Microphone PDM Timing (see )
    16. 8.16 I2C Interface Timing
    17. 8.17 SPI Interface Timing
    18. 8.18 Typical Characteristics
      1. 8.18.1 Typical Performance
      2. 8.18.2 FFT
  9. 9 Parameter Measurement Information
  10. 10Detailed Description
    1. 10.1 Overview
    2. 10.2 Functional Block Diagram
    3. 10.3 Feature Description
      1. 10.3.1 Device Connections
        1. 10.3.1.1 Digital Pins
          1. 10.3.1.1.1 Multifunction Pins
        2. 10.3.1.2 Analog Pins
      2. 10.3.2 Analog Audio I/O
        1. 10.3.2.1 Analog Bypass
        2. 10.3.2.2 ADC Bypass Using Mixer Amplifiers
        3. 10.3.2.3 Headphone Output
        4. 10.3.2.4 Line Outputs
      3. 10.3.3 ADC
        1. 10.3.3.1 ADC Processing
          1. 10.3.3.1.1 ADC Processing Blocks
      4. 10.3.4 DAC
        1. 10.3.4.1 DAC Processing Blocks — Overview
      5. 10.3.5 PowerTune
      6. 10.3.6 Digital Audio IO Interface
      7. 10.3.7 Clock Generation and PLL
      8. 10.3.8 Control Interfaces
        1. 10.3.8.1 I2C Control
        2. 10.3.8.2 SPI Control
    4. 10.4 Device Functional Modes
      1. 10.4.1 MiniDSP
      2. 10.4.2 Software
    5. 10.5 Register Map
      1. 10.5.1 Register Map Summary
  11. 11Application and Implementation
    1. 11.1 Application Information
    2. 11.2 Typical Application
      1. 11.2.1 Design Requirements
        1. 11.2.1.1 Charge Pump Flying and Holding Capacitor
        2. 11.2.1.2 Reference Filtering Capacitor
        3. 11.2.1.3 MICBIAS
      2. 11.2.2 Detailed Design Procedures
        1. 11.2.2.1 Analog Input Connection
        2. 11.2.2.2 Analog Output Connection
      3. 11.2.3 Application Curves
  12. 12Power Supply Recommendations
  13. 13Layout
    1. 13.1 Layout Guidelines
    2. 13.2 Layout Example
  14. 14Device and Documentation Support
    1. 14.1 Documentation Support
      1. 14.1.1 Related Documentation
    2. 14.2 Trademarks
    3. 14.3 Electrostatic Discharge Caution
    4. 14.4 Glossary
  15. 15Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7 Pin Configuration and Functions

QFN
(RSB) Package
Bottom View
rsb_po_los630.gif
WCSP
(YZF) Package
Bottom View
yzf_po_los630.gif

Pin Functions

PIN WCSP (YZF)
BALL NO. 		TYPE(1) DESCRIPTION
NAME QFN (RSB) NO.
DVss 1 B2 GND Digital ground. Device substrate.
DVss 2 A1 GND Digital ground
RESET 3 C5 DI Hardware reset
GPIO 4 B3 DI/O Primary function:
General purpose digital IO
MFP5 Secondary function:
CLKOUT output
INT1 output
INT2 output
Audio serial data bus ADC word clock output
Audio serial data bus (secondary) bit clock output
Audio serial data bus (secondary) word clock output
Digital microphone clock output
MCLK 5 A2 DI Master clock input
BCLK 6 B4 DI/O Audio serial data bus (primary) bit clock
WCLK 7 A3 DI/O Audio serial data bus (primary) word clock
DIN 8 A5 DI Primary function:
Audio serial data bus data input
MFP1 Secondary function:
Digital Microphone Input
General Purpose Clock Input
General Purpose Input
DOUT 9 A4 DO Primary function:
Audio serial data bus data output
MFP2 Secondary function:
General purpose output
Clock output
INT1 output
INT2 output
Audio serial data bus (secondary) bit clock output
Audio serial data bus (secondary) word clock output
IOVdd 10 A6 PWR Supply for IO buffers. 1.1V to 3.6V
IOVss 11 B5 GND Ground for IO buffers.
SCLK 12 C4 DI Primary function: (SPI_Select = 1)
SPI serial clock
MFP3 Secondary function:: (SPI_Select = 0)
Digital microphone input
Audio serial data bus (secondary) bit clock input
Audio serial data bus (secondary) DAC/common word clock input
Audio serial data bus (secondary) ADC word clock input
Audio serial data bus (secondary) data input
General purpose input
SCL
SS		 13 B6 DI I2C interface serial clock (SPI_Select = 0)
SPI interface mode chip-select signal (SPI_Select = 1)
SDA
MOSI		 14 C3 DI/O I2C interface mode serial data input (SPI_Select = 0)
SPI interface mode serial data input (SPI_Select = 1)
MISO 15 D4 DO Primary function: (SPI_Select = 1)
Serial data output
MFP4 Secondary function: (SPI_Select = 0)
General purpose output
CLKOUT output
INT1 output
INT2 output
Audio serial data bus (primary) ADC word clock output
Digital microphone clock output
Audio serial data bus (secondary) data output
Audio serial data bus (secondary) bit clock output
Audio serial data bus (secondary) word clock output
SPI_SELECT 16 C6 DI Control mode select pin ( 1 = SPI, 0 = I2C )
IN1_L 17 D6 AI Multifunction analog input,
Single-ended configuration: MIC 1 or Line 1 left
Differential configuration: MIC or Line right, negative
IN1_R 18 E6 AI Multifunction analog input,
Single-ended configuration: MIC 1 or Line 1 right
Differential configuration: MIC or Line right, positive
IN2_L 19 F6 AI Multifunction analog input,
Single-ended configuration: MIC 2 or Line 2 right
Differential configuration: MIC or Line left, positive
IN2_R 20 G6 AI Multifunction analog input,
Single-ended configuration: MIC 2 or Line 2 right
Differential configuration: MIC or Line left, negative
AVss 21 E4, E5 GND Analog Ground
REF 22 G5 AO Reference voltage output for filtering
MICBIAS 23 G4 AO Microphone bias voltage output
IN3_L 24 F5 AI Multifunction analog input,
Single-ended configuration: MIC3 or Line 3 left,
Differential configuration: MIC or Line left, positive,
Differential configuration: MIC or Line right, negative
IN3_R 25 F4 AI Multifunction analog input,
Single-ended configuration: MIC3 or Line 3 right,
Differential configuration: MIC or Line left, negative,
Differential configuration: MIC or Line right, positive
LOL 26 G3 AO Left line output
LOR 27 F3 AO Right line output
GND_SENSE 28 E3 AI External ground reference for headphone interface –0.5V to 0.5V
AVdd 29 G2 PWR Analog voltage supply 1.5V–1.95V
Vsys 30 G1 PWR Power supply 1.5V–5.5V, Vsys must always be greater than or equal to AVdd and DVdd (Vsys ≥ AVdd, DVdd)
HPL 31 F1 AO Left headphone output
DRVdd_HP 32 F2 PWR Power supply for headphone output stage
Ground-centered circuit configuration, 1.5V to 1.95V
Unipolar circuit configuration, 1.5V to 3.6V
HPR 33 E1 AO Right headphone output
MICDET 34 E2 AI Microphone detection
VNEG 35 D1 PWR Negative supply for headphones. –1.8V to 0V
Input when charge pump is disabled,
Filtering output when charge pump is enabled
FLY_N 36 D2 PWR Negative terminal for charge-pump flying capacitor
DVss_CP 37 D3 GND Charge pump ground
FLY_P 38 C2 PWR Positive terminal for charge pump flying capacitor
DVdd_CP 39 C1 PWR Charge Pump supply; recommended to connect to DVdd
DVdd 40 B1 PWR Digital voltage supply 1.26V – 1.95V
Thermal Pad Thermal Pad N/A N/A Connect to PCB ground plane. Not internally connected.
(1) DI (Digital Input), DO (Digital Output), DIO (Digital Input/Output), AI (Analog Input), AO (Analog Output), AIO (Analog Input/Output)