SLAS538B October   2007  – November 2016 TLV320AIC34

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Description (continued)
  6. 6 Device Comparison Table
  7. 7 Pin Configuration and Functions
  8. 8 Specifications
    1. 8.1 Absolute Maximum Ratings
    2. 8.2 ESD Ratings
    3. 8.3 Recommended Operating Conditions
    4. 8.4 Thermal Information
    5. 8.5 Electrical Characteristics
    6. 8.6 Timing Requirements
    7. 8.7 Typical Characteristics
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1  Hardware Reset
      2. 9.3.2  I2C Bus Debug In A Glitched System
      3. 9.3.3  Digital Audio Data Serial Interface
      4. 9.3.4  TDM Data Transfer
      5. 9.3.5  Audio Data Converters
      6. 9.3.6  Audio Clock Generation
      7. 9.3.7  Stereo Audio ADC
        1. 9.3.7.1 Stereo Audio ADC High-pass Filter
      8. 9.3.8  Digital Audio Processing For Record Path
      9. 9.3.9  Automatic Gain Control (AGC)
      10. 9.3.10 Stereo Audio DAC
      11. 9.3.11 Digital Audio Processing For Playback
      12. 9.3.12 Digital Interpolation Filter
      13. 9.3.13 Delta-Sigma Audio DAC
      14. 9.3.14 Audio DAC Digital Volume Control
      15. 9.3.15 Increasing DAC Dynamic Range
      16. 9.3.16 Analog Output Common-Mode Adjustment
      17. 9.3.17 Audio DAC Power Control
      18. 9.3.18 Audio Analog Inputs
      19. 9.3.19 Analog Input Bypass Path Functionality
      20. 9.3.20 ADC PGA Signal Bypass Path Functionality
      21. 9.3.21 Input Impedance and VCM Control
      22. 9.3.22 Passive Analog Bypass During Power Down
      23. 9.3.23 MICBIAS_x Generation
      24. 9.3.24 Digital Microphone Connectivity
      25. 9.3.25 Analog Fully Differential Line Output Drivers
      26. 9.3.26 Analog High-Power Output Drivers
      27. 9.3.27 Short-Circuit Output Protection
      28. 9.3.28 Jack or Headset Detection
      29. 9.3.29 Output Stage Volume Controls
    4. 9.4 Device Functional Modes
      1. 9.4.1 I2C Control Mode
      2. 9.4.2 Right-Justified Mode
      3. 9.4.3 Left-Justified Mode
      4. 9.4.4 I2S Mode
      5. 9.4.5 DSP Mode
    5. 9.5 Programming
      1. 9.5.1 Digital Control Serial Interface
    6. 9.6 Register Maps
      1. 9.6.1 Register Description
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
      3. 10.2.3 Application Curves
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Documentation Support
      1. 13.1.1 Related Documentation
    2. 13.2 Receiving Notification of Documentation Updates
    3. 13.3 Related Links
    4. 13.4 Community Resources
    5. 13.5 Trademarks
    6. 13.6 Electrostatic Discharge Caution
    7. 13.7 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • ZAS|87
Thermal pad, mechanical data (Package|Pins)
Orderable Information

13 Device and Documentation Support

13.1 Documentation Support

13.1.1 Related Documentation

For related documentation see the following:

13.2 Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document.

13.3 Related Links

Table 11 lists quick access links. Categories include technical documents, support and community resources, tools and software, and quick access to sample or buy.

Table 11. Related Links

PARTS PRODUCT FOLDER SAMPLE & BUY TECHNICAL DOCUMENTS TOOLS & SOFTWARE SUPPORT & COMMUNITY
TLV320AIC34 Click here Click here Click here Click here Click here
TLV320AIC3106 Click here Click here Click here Click here Click here
TLV320AIC3104 Click here Click here Click here Click here Click here
TLV320AIC3120 Click here Click here Click here Click here Click here

13.4 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

13.5 Trademarks

E2E is a trademark of Texas Instruments.

Bluetooth is a trademark of Bluetooth SIG, Inc.

All other trademarks are the property of their respective owners.

13.6 Electrostatic Discharge Caution

esds-image

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

13.7 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.