SLOS756B
May 2012 – December 2018
TLV320DAC3203
PRODUCTION DATA.
1
Features
2
Applications
3
Description
Device Images
Simplified Block Diagram
4
Revision History
5
Pin Configuration and Functions
Pin Functions
6
Specifications
6.1
Absolute Maximum Ratings
6.2
ESD Ratings
6.3
Recommended Operating Conditions
6.4
Thermal Information
6.5
Electrical Characteristics, Bypass Outputs
6.6
Electrical Characteristics, Microphone Interface
6.7
Electrical Characteristics, Audio Outputs
6.8
Electrical Characteristics, LDO
6.9
Electrical Characteristics, Misc.
6.10
Electrical Characteristics, Logic Levels
6.11
Typical Timing Characteristics — Audio Data Serial Interface Timing (I2S)
6.12
Typical DSP Timing Characteristics
6.13
I2C Interface Timing
6.14
SPI Interface Timing (See )
6.15
Typical Characteristics
6.15.1
Typical Characteristics, FFT
7
Detailed Description
7.1
Overview
7.2
Functional Block Diagram
7.3
Feature Description
7.3.1
Device Connections
7.3.1.1
Digital Pins
7.3.1.1.1
Multifunction Pins
7.3.1.2
Analog Pins
7.3.2
Analog Audio I/O
7.3.2.1
Analog Low Power Bypass
7.3.2.2
Headphone Outputs
7.3.3
Digital Microphone Inteface
7.3.3.1
ADC Processing Blocks — Overview
7.3.3.1.1
Processing Blocks
7.3.4
DAC
7.3.4.1
DAC Processing Blocks — Overview
7.3.5
Powertune
7.3.6
Digital Audio I/O Interface
7.3.7
Clock Generation and PLL
7.3.8
Control Interfaces
7.3.8.1
I2C Control
7.3.8.2
SPI Control
7.4
Device Functional Modes
7.5
Register Maps
8
Application and Implementation
8.1
Application Information
8.2
Typical Application
8.2.1
Design Requirements
8.2.2
Detailed Design Procedure
8.2.3
Application Curves
9
Power Supply Recommendations
10
Layout
10.1
Layout Guidelines
10.2
Layout Example
11
Device and Documentation Support
11.1
Documentation Support
11.1.1
Related Documentation
11.2
Receiving Notification of Documentation Updates
11.3
Community Resources
11.4
Trademarks
11.5
Electrostatic Discharge Caution
11.6
Glossary
12
Mechanical, Packaging, and Orderable Information
Package Options
Mechanical Data (Package|Pins)
YZK|25
MXBG031E
RGE|24
MPQF124G
Thermal pad, mechanical data (Package|Pins)
RGE|24
QFND136Y
Orderable Information
slos756b_oa
slos756b_pm