SNOSDB1E june   2021  – april 2023 TLV3601 , TLV3602 , TLV3603 , TLV3603E

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Diagrams
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
      1. 7.4.1 Inputs
      2. 7.4.2 Push-Pull (Single-Ended) Output
      3. 7.4.3 Known Startup Condition
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Adjustable Hysteresis
      2. 8.1.2 Capacitive Loads
      3. 8.1.3 Latch Functionality
    2. 8.2 Typical Application
      1. 8.2.1 Implementing Hysteresis
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curve
      2. 8.2.2 Optical Receiver
      3. 8.2.3 Over-Current Latch Condition
      4. 8.2.4 External Trigger Function for Oscilloscopes
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Information

THERMAL METRIC TLV3601 TLV3601 TLV3602 TLV3602 TLV3603 (E) UNIT
DBV (SOT-23) DCK (SC70) DGK (VSSOP) DSG (WSON) DCK (SC70)
5 PINS 5 PINS 8 PINS 8 PINS 6 PINS
RθJA Junction-to-ambient thermal resistance 176.5 187.5 170.5 64.9 165.1 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 74.7 139.2 61.7 83.9 129.1 °C/W
RθJC(bottom) Junction-to-case (bottom) thermal resistance N/A N/A N/A 5.5 N/A °C/W
RθJB Junction-to-board thermal resistance 43.4 65.8 92.4 32.0 58.9 °C/W
ψJT Junction-to-top characterization parameter 16.7 43.0 8.9 2.1 39.4 °C/W
ψJB Junction-to-board characterization parameter 43.1 65.5 90.8 32.0 58.7 °C/W