SNOSDA2F August   2020  – June 2024 TLV3604 , TLV3605 , TLV3607

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
    1.     Pin Configurations: TLV3604 and TLV3605
    2. 4.1 Pin Configuration: TLV3607
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics (VCCI = VCCO = 2.5V to 5V)
    6. 5.6 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
    4. 6.4 Device Functional Modes
      1. 6.4.1 Rail-to-Rail Inputs
      2. 6.4.2 LVDS Output
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Comparator Inputs
      2. 7.1.2 Capacitive Loads
      3. 7.1.3 Latch Functionality
      4. 7.1.4 Adjustable Hysteresis
    2. 7.2 Typical Application
      1. 7.2.1 Non-Inverting Comparator With Hysteresis
        1. 7.2.1.1 Design Requirements
        2. 7.2.1.2 Detailed Design Procedure
        3. 7.2.1.3 Application Performance Plots
      2. 7.2.2 Optical Receiver
      3. 7.2.3 Logic Clock Source to LVDS Transceiver
      4. 7.2.4 External Trigger Function for Oscilloscopes
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Development Support
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.4 Thermal Information

THERMAL METRIC TLV3604 TLV3605 TLV3607 UNIT
DCK (SC70) RVK (WQFN) RTE (WQFN)
6 PINS 12 PINS 16 PINS
RθJA Junction-to-ambient thermal resistance 170.3 85.8 72.1 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 134.5 71.6 53.8 °C/W
RθJC(bottom) Junction-to-case (bottom) thermal resistance N/A 15.1 35.7 °C/W
RθJB Junction-to-board thermal resistance 63.3 52.7 45.9 °C/W
ψJT Junction-to-top characterization parameter 43.7 4.1 2.1 °C/W
ψJB Junction-to-board characterization parameter 63.1 52.7 45.9 °C/W