SBOSAB8B June   2023  – September 2024 TLV2365-Q1 , TLV365-Q1

PRODMIX  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Device Comparison Table
  6. Pin Configuration and Functions
  7. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  8. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Rail-to-Rail Input
      2. 7.3.2 Input and ESD Protection
      3. 7.3.3 Driving Capacitive Loads
      4. 7.3.4 Active Filter
    4. 7.4 Device Functional Modes
  9. Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Overdrive Recovery Performance
      2. 8.1.2 Achieving an Output Level of Zero Volts
    2. 8.2 Typical Applications
      1. 8.2.1 Second-Order Low-Pass Filter
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curve
      2. 8.2.2 ADC Driver and Reference Buffer
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Development Support
        1. 9.1.1.1 PSpice® for TI
        2. 9.1.1.2 TINA-TI™ Simulation Software (Free Download)
        3. 9.1.1.3 DIP-Adapter-EVM
        4. 9.1.1.4 DIYAMP-EVM
        5. 9.1.1.5 TI Reference Designs
        6. 9.1.1.6 Analog Filter Designer
    2. 9.2 Documentation Support
      1. 9.2.1 Related Documentation
    3. 9.3 Receiving Notification of Documentation Updates
    4. 9.4 Support Resources
    5. 9.5 Trademarks
    6. 9.6 Electrostatic Discharge Caution
    7. 9.7 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DBV|5
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Driving Capacitive Loads

The TLVx365-Q1 can be used in applications where driving a capacitive load is required. An op amp in a unity-gain, buffer configuration and driving a capacitive load exhibits a greater tendency to be unstable than an amplifier operated at a higher gain. The capacitive load, in conjunction with the op-amp output impedance, creates a pole within the feedback loop that degrades the phase margin. The degradation of the phase margin increases as the capacitive loading increases. This degradation is observed in the increase in peaking with increased capacitive load in Figure 6-16.

Improving Capacitive Load Drive shows one technique to increase the capacitive-load drive capability of the amplifier operating in unity gain is to insert a small resistor, RISO, in series with the output. This resistor significantly reduces the overshoot and ringing associated with capacitive loads.

TLV365-Q1 TLV2365-Q1 Improving Capacitive Load
                    Drive Figure 7-4 Improving Capacitive Load Drive

A possible drawback of this technique is the voltage divider created with the added series resistor (RISO) and any resistor (RL) connected in parallel with the capacitive load. The voltage divider introduces a gain error at the output that also reduces the output swing. The error contributed by the voltage divider can be insignificant. For instance, with a load resistance of RL = 10 kΩ and RISO = 20 Ω, the gain error is only approximately 0.2%.

The following figure shows the recommended isolation resistor (RISO) to be connected at the output of TLVx365-Q1 for different capacitive loads. The TLVx365-Q1 can drive higher capacitive loads without the need of isolation resistors at higher gains.

TLV365-Q1 TLV2365-Q1 Recommended Isolation Resistor vs Capacitive Load
For gain > 1 V/V, RF = 1 kΩ
For gain = 1 V/V, RF = 0 Ω
Figure 7-5 Recommended Isolation Resistor vs Capacitive Load