SBOSAA8C December   2022  – August 2024 TLV2365 , TLV365

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Rail-to-Rail Input
      2. 7.3.2 Input and ESD Protection
      3. 7.3.3 Driving Capacitive Loads
      4. 7.3.4 Active Filter
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Overdrive Recovery Performance
      2. 8.1.2 Achieving an Output Level of Zero Volts
    2. 8.2 Typical Applications
      1. 8.2.1 Second-Order Low-Pass Filter
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curve
      2. 8.2.2 ADC Driver and Reference Buffer
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Development Support
        1. 9.1.1.1 PSpice® for TI
        2. 9.1.1.2 TINA-TI™ Simulation Software (Free Download)
        3. 9.1.1.3 DIP-Adapter-EVM
        4. 9.1.1.4 DIYAMP-EVM
        5. 9.1.1.5 TI Reference Designs
        6. 9.1.1.6 Analog Filter Designer
    2. 9.2 Documentation Support
      1. 9.2.1 Related Documentation
    3. 9.3 Receiving Notification of Documentation Updates
    4. 9.4 Support Resources
    5. 9.5 Trademarks
    6. 9.6 Electrostatic Discharge Caution
    7. 9.7 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DBV|5
Thermal pad, mechanical data (Package|Pins)
Orderable Information

3 Description

The TLV365 and TLV2365 devices (TLVx365) are a family of zero-crossover, rail-to-rail input and output, CMOS operational amplifiers, optimized for low voltage and cost-sensitive applications. Low-noise (4.5nV/√Hz) and high-speed operation (50MHz gain bandwidth) make these devices an excellent choice for driving sampling analog-to-digital converters (ADCs) in applications such as low-side current sensing, audio, signal conditioning, and sensor amplification.

Special features include an excellent common-mode rejection ratio (CMRR), no input stage crossover distortion, high input impedance, and rail-to-rail input and output swing. The input common-mode range includes both the negative and positive supplies. The output voltage swings to within 10mV of the rails.

The TLVx365 are specified for operation from −40°C to +125°C.

Device Information
PART NUMBER CHANNEL COUNT PACKAGE(1)
TLV365 Single DBV (SOT-23, 5)
TLV2365 Dual D (SOIC, 8)
Dual DGK (VSSOP, 8)
(1) For more information, see Section 11.

 

TLV365 TLV2365 Fast-Settling Peak DetectorFast-Settling Peak Detector
TLV365 TLV2365 Current SensingCurrent Sensing