SNOSDF4A October   2022  – December 2023 TLV3801-Q1 , TLV3802-Q1

PRODMIX  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Thermal Information
    4. 6.4 Recommended Operating Conditions
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Diagrams
    7. 6.7 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
      1. 7.4.1 Inputs
      2. 7.4.2 LVDS Output
  9. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Capacitive Loads
      2. 8.1.2 Hysteresis
    2. 8.2 Typical Application
      1. 8.2.1 Optical Receiver
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Performance Plots
      2. 8.2.2 Non-Inverting Comparator With Hysteresis
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
        3. 8.2.2.3 Application Performance Plots
      3. 8.2.3 Logic Clock Source to LVDS Transceiver
      4. 8.2.4 External Trigger Function for Oscilloscopes
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Development Support
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.3 Thermal Information

THERMAL METRIC(1) TLV3801-Q1 TLV3802-Q1 UNIT
DSG (WSON) DSS (WSON)
8 PINS 12 PINS
RqJA Junction-to-ambient thermal resistance 69.4 63.2 °C/W
RqJC(top) Junction-to-case (top) thermal resistance 95.7 61.9 °C/W
RqJB Junction-to-board thermal resistance 36.2 30.7 °C/W
yJT Junction-to-top characterization parameter 3.5 2.4 °C/W
yJB Junction-to-board characterization parameter 36.0 30.7 °C/W
RqJC(bot) Junction-to-case (bottom) thermal resistance 9.4 8.7 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.