SBOSA91B December   2021  – December 2023 TLV2387 , TLV387 , TLV4387

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information: TLV387
    5. 5.5 Thermal Information: TLV2387
    6. 5.6 Thermal Information: TLV4387
    7. 5.7 Electrical Characteristics
    8. 5.8 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Input Bias Current
      2. 6.3.2 EMI Susceptibility and Input Filtering
    4. 6.4 Device Functional Modes
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Zero-Drift Clocking
    2. 7.2 Typical Applications
      1. 7.2.1 Bidirectional Current Sensing
        1. 7.2.1.1 Design Requirements
        2. 7.2.1.2 Detailed Design Procedure
        3. 7.2.1.3 Application Curve
      2. 7.2.2 Load Cell Measurement
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Development Support
        1. 8.1.1.1 PSpice® for TI
        2. 8.1.1.2 TINA-TI™ Simulation Software (Free Download)
    2. 8.2 Documentation Support
      1. 8.2.1 Related Documentation
    3. 8.3 Receiving Notification of Documentation Updates
    4. 8.4 Support Resources
    5. 8.5 Trademarks
    6. 8.6 Electrostatic Discharge Caution
    7. 8.7 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DBV|5
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Pin Configuration and Functions

GUID-9446DFB2-24A0-447B-A4B5-87A0485FF3EC-low.gifFigure 4-1 TLV387: DBV Package, 5-Pin SOT-23 (Top View)
Table 4-1 Pin Functions: TLV387
PIN TYPE DESCRIPTION
NAME NO.
–IN 3 Input Inverting input
+IN 4 Input Noninverting input
OUT 6 Output Output
V– 5 Power Negative (lowest) power supply
V+ 1 Power Positive (highest) power supply
GUID-CD30933B-FDA3-4D18-BF91-4064782A917F-low.gifFigure 4-2 TLV2387: D Package, 8-Pin SOIC and
DGK Package, 8-Pin VSSOP
(Top View)
Table 4-2 Pin Functions: TLV2387
PIN TYPE DESCRIPTION
NAME NO.
D (SOIC), DGK (VSSOP) DSG (WSON)
–IN A 2 2 Input Inverting input, channel A
–IN B 6 6 Input Inverting input, channel B
+IN A 3 3 Input Noninverting input, channel A
+IN B 5 5 Input Noninverting input, channel B
OUT A 1 1 Output Output, channel A
OUT B 7 7 Output Output, channel B
V– 4 4 Power Negative (lowest) power supply
V+ 8 8 Power Positive (highest) power supply
Thermal Pad — Thermal pad — Connect thermal pad to V–
GUID-E4345B66-106B-4662-8A41-57CE2F2BD88F-low.gifFigure 4-3 TLV4387: PW Package, 14-Pin TSSOP (Top View)
Table 4-3 Pin Functions: TLV4387
PIN TYPE DESCRIPTION
NAME NO.
–IN A 2 Input Inverting input, channel A
–IN B 6 Input Inverting input, channel B
–IN C 9 Input Inverting input, channel C
–IN D 13 Input Inverting input, channel D
+IN A 3 Input Noninverting input, channel A
+IN B 5 Input Noninverting input, channel B
+IN C 10 Input Noninverting input, channel C
+IN D 12 Input Noninverting input, channel D
OUT A 1 Output Output, channel A
OUT B 7 Output Output, channel B
OUT C 8 Output Output, channel C
OUT D 14 Output Output, channel D
V– 11 Power Negative (lowest) power supply
V+ 4 Power Positive (highest) power supply