SBOSA91B December 2021 – December 2023 TLV2387 , TLV387 , TLV4387
PRODUCTION DATA
Refer to the PDF data sheet for device specific package drawings
THERMAL METRIC(1) | TLV387 | UNIT | |
---|---|---|---|
DBV (SOT-23) | |||
5 PINS | |||
RθJA | Junction-to-ambient thermal resistance | 187.1 | °C/W |
RθJC(top) | Junction-to-case(top) thermal resistance | 107.4 | °C/W |
RθJB | Junction-to-board thermal resistance | 57.5 | °C/W |
ψJT | Junction-to-top characterization parameter | 33.5 | °C/W |
ψJB | Junction-to-board characterization parameter | 57.1 | °C/W |
RθJC(bot) | Junction-to-case(bottom) thermal resistance | N/A | °C/W |