SBOS784C November   2016  – January 2019 TLV172 , TLV2172 , TLV4172

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Simplified Schematic
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
    1.     Pin Functions: TLV172
    2.     Pin Functions: TLV2172
    3.     Pin Functions: TLV4172
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information: TLV172
    5. 7.5 Thermal Information: TLV2172
    6. 7.6 Thermal Information: TLV4172
    7. 7.7 Electrical Characteristics
    8. 7.8 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Operating Characteristics
      2. 8.3.2 Phase-Reversal Protection
      3. 8.3.3 Electrical Overstress
      4. 8.3.4 Capacitive Load and Stability
    4. 8.4 Device Functional Modes
      1. 8.4.1 Common-Mode Voltage Range
      2. 8.4.2 Overload Recovery
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Third-Party Products Disclaimer
      2. 12.1.2 Development Support
        1. 12.1.2.1 TINA-TI™ (Free Software Download)
        2. 12.1.2.2 DIP Adapter EVM
        3. 12.1.2.3 Universal Op Amp EVM
        4. 12.1.2.4 TI Precision Designs
        5. 12.1.2.5 WEBENCH Filter Designer
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 Related Links
    4. 12.4 Receiving Notification of Documentation Updates
    5. 12.5 Community Resources
    6. 12.6 Trademarks
    7. 12.7 Electrostatic Discharge Caution
    8. 12.8 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6 Pin Configuration and Functions

TLV172 DCK Package
5-Pin SC70
Top View
TLV172 DBV Package
5-Pin SOT-23
Top View
TLV172 D Package
8-Pin SOIC
Top View
NC- no internal connection

Pin Functions: TLV172

PIN I/O DESCRIPTION
NAME SC70 SOT-23 SOIC
–IN 3 4 2 I Negative (inverting) input
+IN 1 3 3 I Positive (noninverting) input
NC — — 1, 5, 8 — No internal connection (can be left floating)
OUT 4 1 6 O Output
V– 2 2 4 — Negative (lowest) power supply
V+ 5 5 7 — Positive (highest) power supply
TLV2172 D and DGK Packages
8-Pin SOIC and VSSOP
Top View

Pin Functions: TLV2172

PIN I/O DESCRIPTION
NAME SOIC
(D)		 VSSOP
(DGK)
–IN A 2 2 I Inverting input, channel A
–IN B 6 6 I Inverting input, channel B
+IN A 3 3 I Noninverting input, channel A
+IN B 5 5 I Noninverting input, channel B
OUT A 1 1 O Output, channel A
OUT B 7 7 O Output, channel B
V– 4 4 — Negative (lowest) power supply
V+ 8 8 — Positive (highest) power supply
TLV4172 D and PW Packages
14-Pin SOIC and TSSOP
Top View

Pin Functions: TLV4172

PIN I/O DESCRIPTION
NAME SOIC
(D)		 TSSOP
(PW)
–IN A 2 2 I Inverting input, channel A
–IN B 6 6 I Inverting input, channel B
–IN C 9 9 I Inverting input, channel C
–IN D 13 13 I Inverting input, channel D
+IN A 3 3 I Noninverting input, channel A
+IN B 5 5 I Noninverting input, channel B
+IN C 10 10 I Noninverting input, channel C
+IN D 12 12 I Noninverting input, channel D
OUT A 1 1 O Output, channel A
OUT B 7 7 O Output, channel B
OUT C 8 8 O Output, channel C
OUT D 14 14 O Output, channel D
V– 11 11 — Negative (lowest) power supply
V+ 4 4 — Positive (highest) power supply