TLVx313 Low-Power, Rail-to-Rail In/Out, 500-µV Typical Offset, 1-MHz Operational Amplifier for Cost-Sensitive Systems

1 Features

• Precision Amplifier for Cost-Sensitive Systems
• Low I_Q: 65 µA/ch
• Wide Supply Range: 1.8 V to 5.5 V
• Low Noise: 26 nV/√Hz at 1 kHz
• Gain Bandwidth: 1 MHz
• Rail-to-Rail Input/Output
• Low Input Bias Current: 1 pA
• Low Offset Voltage: 0.75 mV
• Unity-Gain Stable
• Internal RF/EMI Filter
• Extended Temperature Range:
  –40°C to +125°C

2 Applications

• Medical and Healthcare
• Fitness and Wearable Electronics
• Utility Metering (Heat, Water, Energy)
• Building Automation Equipment
• Currency Counters

CMRR and PSRR vs Temperature

3 Description

The TLV313 family of single-, dual-, and quad-channel precision operational amplifiers combine low power consumption with good performance. This makes them suitable for a wide range of applications, such as wearables, utility metering, building automation, currency counters and more. The family features rail-to-rail input and output (RRIO) swings, low quiescent current (65 μA, typical), wide bandwidth (1 MHz) and very low noise (26 nV/√Hz at 1 kHz), making it attractive for a variety of battery-powered applications that require a good balance between cost and performance. Further, low-input-bias current enables these devices to be used in applications with megaohm source impedances.

The robust design of the TLV313 devices provides ease-of-use to the circuit designer: unity-gain stability with capacitive loads of up to 150 pF, integrated RF/EMI rejection filter, no phase reversal in overdrive conditions, and high electrostatic discharge (ESD) protection (4-kV HBM).

The devices are optimized for operation at voltages as low as +1.8 V (±0.9 V) and up to +5.5 V (±2.75 V), and are specified over the extended temperature range of –40°C to +125°C.

The single-channel TLV313 device is available in both SC70-5 and SOT23-5 packages. The dual-channel TLV2313 device is offered in SOIC-8 and VSSOP-8 packages, and the quad-channel TLV4313 device is offered in a TSSOP-14 package.

1. For all available packages, see the orderable addendum at the end of the data sheet.

4 Revision History

Changes from A Revision (June 2016) to B Revision

• Changed pin assignment for DCK packageGo

Changes from * Revision (June 2016) to A Revision

• Changed Product Status from Product Preview to Production Data Go
• Changed the formatting of the Related Documentation section Go
• Changed wording in the Receiving Notification of Documentation Updates section Go

5 Device Comparison Table

6 Pin Configuration and Functions