SBOS753B
June 2016 – February 2017
TLV2313
,
TLV313
,
TLV4313
PRODUCTION DATA.
1
Features
2
Applications
3
Description
4
Revision History
5
Device Comparison Table
6
Pin Configuration and Functions
7
Specifications
7.1
Absolute Maximum Ratings
7.2
ESD Ratings
7.3
Recommended Operating Conditions
7.4
Thermal Information: TLV313
7.5
Thermal Information: TLV2313
7.6
Thermal Information: TLV4313
7.7
Electrical Characteristics: 5.5 V
7.8
Electrical Characteristics: 1.8 V
7.9
Typical Characteristics: Table of Graphs
7.10
Typical Characteristics
8
Detailed Description
8.1
Overview
8.2
Functional Block Diagram
8.3
Feature Description
8.3.1
Operating Voltage
8.3.2
Rail-to-Rail Input
8.3.3
Rail-to-Rail Output
8.3.4
Common-Mode Rejection Ratio (CMRR)
8.3.5
Capacitive Load and Stability
8.3.6
EMI Susceptibility and Input Filtering
8.4
Device Functional Modes
9
Application and Implementation
9.1
Application Information
9.2
Typical Application
9.2.1
Design Requirements
9.2.2
Detailed Design Procedure
9.2.3
Application Curve
9.3
System Examples
10
Power Supply Recommendations
10.1
Input and ESD Protection
11
Layout
11.1
Layout Guidelines
11.2
Layout Example
12
Device and Documentation Support
12.1
Documentation Support
12.1.1
Related Documentation
12.2
Receiving Notification of Documentation Updates
12.3
Related Links
12.4
Community Resources
12.5
Trademarks
12.6
Electrostatic Discharge Caution
12.7
Glossary
13
Mechanical, Packaging, and Orderable Information
Package Options
Mechanical Data (Package|Pins)
PW|14
MPDS360A
Thermal pad, mechanical data (Package|Pins)
Orderable Information
sbos753b_oa
sbos753b_pm
5
Device Comparison Table
DEVICE
NO. OF
CHANNELS
PACKAGE LEADS
SC70
SOT23
SOIC
VSSOP
TSSOP
TLV313
1
5
5
—
—
—
TLV2313
2
—
—
8
8
—
TLV4313
4
—
—
—
—
14