SBOS934A August   2018  – December 2018 TLV6001-Q1 , TLV6002-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     CMRR and PSRR vs Temperature
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions: TLV6001-Q1
    2.     Pin Functions: TLV6002-Q1
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information: TLV6001-Q1
    5. 6.5 Thermal Information: TLV6002-Q1
    6. 6.6 Electrical Characteristics: VS = 1.8 V to 5 V (±0.9 V to ±2.75 V)
    7. 6.7 Typical Characteristics: Table of Graphs
    8. 6.8 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Operating Voltage
      2. 7.3.2 Rail-to-Rail Input
      3. 7.3.3 Rail-to-Rail Output
      4. 7.3.4 Common-Mode Rejection Ratio (CMRR)
      5. 7.3.5 Capacitive Load and Stability
      6. 7.3.6 EMI Susceptibility and Input Filtering
    4. 7.4 Device Functional Modes
    5. 7.5 Input and ESD Protection
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
    3. 8.3 System Examples
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example: Single Channel
    3. 10.3 Layout Example: Dual Channel
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Related Links
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Community Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|8
  • DGK|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.5 Thermal Information: TLV6002-Q1

THERMAL METRIC(1) TLV6002-Q1 UNIT
D (SOIC) DGK (VSSOP)
8 PINS 8 PINS
RθJA Junction-to-ambient thermal resistance 131.6 186.0 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 71.4 73.2 °C/W
RθJB Junction-to-board thermal resistance 75.4 107.3 °C/W
ψJT Junction-to-top characterization parameter 22.7 14.4 °C/W
ψJB Junction-to-board characterization parameter 74.6 105.6 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.