SLVSB74H February   2012  – June 2018 TLV62130 , TLV62130A

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Typical Application Schematic
      2.      Efficiency vs Output Current
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Enable / Shutdown (EN)
      2. 8.3.2 Soft Start / Tracking (SS/TR)
      3. 8.3.3 Power Good (PG)
      4. 8.3.4 Pin-Selectable Output Voltage (DEF)
      5. 8.3.5 Frequency Selection (FSW)
      6. 8.3.6 Undervoltage Lockout (UVLO)
      7. 8.3.7 Thermal Shutdown
    4. 8.4 Device Functional Modes
      1. 8.4.1 Pulse Width Modulation (PWM) Operation
      2. 8.4.2 Power Save Mode Operation
      3. 8.4.3 100% Duty-Cycle Operation
      4. 8.4.4 Current Limit and Short Circuit Protection
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Custom Design With WEBENCH® Tools
        2. 9.2.2.2 Programming the Output Voltage
        3. 9.2.2.3 External Component Selection
          1. 9.2.2.3.1 Inductor Selection
          2. 9.2.2.3.2 Capacitor Selection
            1. 9.2.2.3.2.1 Output Capacitor
            2. 9.2.2.3.2.2 Input Capacitor
            3. 9.2.2.3.2.3 Soft Start Capacitor
        4. 9.2.2.4 Tracking Function
        5. 9.2.2.5 Output Filter and Loop Stability
      3. 9.2.3 Application Curves
    3. 9.3 System Examples
      1. 9.3.1 LED Power Supply
      2. 9.3.2 Active Output Discharge
      3. 9.3.3 Inverting Power Supply
      4. 9.3.4 Various Output Voltages
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
    3. 11.3 Thermal Considerations
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Third-Party Products Disclaimer
      2. 12.1.2 Development Support
        1. 12.1.2.1 Custom Design With WEBENCH® Tools
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Documentation Support
      1. 12.3.1 Related Documentation
    4. 12.4 Related Links
    5. 12.5 Community Resources
    6. 12.6 Trademarks
    7. 12.7 Electrostatic Discharge Caution
    8. 12.8 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6 Pin Configuration and Functions

RGT Package
16-Pin VQFN
Top View

Pin Functions

PIN(1) I/O DESCRIPTION
NAME NO.
AGND 6 — Analog Ground. Must be connected directly to the Exposed Thermal Pad and common ground plane.
AVIN 10 I Supply voltage for control circuitry. Connect to same source as PVIN.
DEF 8 I Output Voltage Scaling (Low = nominal, High = nominal + 5%)(3)
EN 13 I Enable input (High = enabled, Low = disabled)(3)
FB 5 I Voltage feedback. Connect resistive voltage divider to this pin.
FSW 7 I Switching Frequency Select (Low ≈ 2.5 MHz, High ≈ 1.25 MHz(2) for typical operation)(3)
PG 4 O Output power good (High = VOUT ready, Low = VOUT below nominal regulation) ; open drain (requires pull-up resistor)
PGND 15, 16 — Power ground. Must be connected directly to the Exposed Thermal Pad and common ground plane.
PVIN 11, 12 I Supply voltage for power stage. Connect to same source as AVIN.
SS/TR 9 I Soft-Start / Tracking Pin. An external capacitor connected to this pin sets the internal voltage reference rise time. It can be used for tracking and sequencing.
SW 1, 2, 3 O Switch node, which is connected to the internal MOSFET switches. Connect inductor between SW and output capacitor.
VOS 14 I Output voltage sense pin and connection for the control loop circuitry.
Exposed Thermal Pad — — Must be connected to AGND (pin 6), PGND (pin 15,16) and common ground plane. See Layout Example. Must be soldered to achieve appropriate power dissipation and mechanical reliability.
(1) For more information about connecting pins, see Detailed Description and Application and Implementation sections.
(2) Connect FSW to VOUT or PG in this case.
(3) An internal pull-down resistor keeps logic level low, if pin is floating.