SNVSAV2B January   2018  – November 2019 TLV6700

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Simplified Block Diagram
      2.      Output Response
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 Switching Characteristics
    8. 7.8 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Inputs (INA+, INB–)
      2. 8.3.2 Outputs (OUTA, OUTB)
      3. 8.3.3 Window Comparator
      4. 8.3.4 Immunity to Input Terminal Voltage Transients
    4. 8.4 Device Functional Modes
      1. 8.4.1 Normal Operation (VDD > UVLO)
      2. 8.4.2 Undervoltage Lockout (V(POR) < VDD < UVLO)
      3. 8.4.3 Power-On Reset (VDD < V(POR))
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 VPULLUP to a Voltage Other Than VDD
      2. 9.1.2 Monitoring VDD
      3. 9.1.3 Monitoring a Voltage Other Than VDD
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Resistor Divider Selection
        2. 9.2.2.2 Pullup Resistor Selection
        3. 9.2.2.3 Input Supply Capacitor
        4. 9.2.2.4 Input Capacitors
      3. 9.2.3 Application Curves
    3. 9.3 Do's and Don'ts
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Development Support
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Community Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

12.1.1 Development Support

The DIP Adapter Evaluation Module allows conversion of the SOT-23-6 package to a standard DIP-6 pinout for ease of prototyping and bench evaluation.