SLVSDM5F September   2017  – March 2020 TLV7011 , TLV7012 , TLV7021 , TLV7022

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      X2SON Package vs SC70 and US Dime
      2.      Propagation Delay vs. Overdrive
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
    2.     Pin Functions: TLV7012/22
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings (Single)
    2. 6.2  Absolute Maximum Ratings (Dual)
    3. 6.3  ESD Ratings
    4. 6.4  Recommended Operating Conditions (Single)
    5. 6.5  Recommended Operating Conditions (Dual)
    6. 6.6  Thermal Information (Single)
    7. 6.7  Thermal Information (Dual)
    8. 6.8  Electrical Characteristics (Single)
    9. 6.9  Switching Characteristics (Single)
    10. 6.10 Electrical Characteristics (Dual)
    11. 6.11 Switching Characteristics (Dual)
    12. 6.12 Timing Diagrams
    13. 6.13 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
      1. 7.4.1 Inputs
      2. 7.4.2 Internal Hysteresis
      3. 7.4.3 Output
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Inverting Comparator With Hysteresis for TLV701x
      2. 8.1.2 Noninverting Comparator With Hysteresis for TLV701x
    2. 8.2 Typical Applications
      1. 8.2.1 Window Comparator
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curve
      2. 8.2.2 IR Receiver Analog Front End
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
        3. 8.2.2.3 Application Curve
      3. 8.2.3 Square-Wave Oscillator
        1. 8.2.3.1 Design Requirements
        2. 8.2.3.2 Detailed Design Procedure
        3. 8.2.3.3 Application Curve
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
        1. 11.1.1.1 Evaluation Module
    2. 11.2 Related Links
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Community Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

10.1 Layout Guidelines

To reduce PCB fabrication cost and improve reliability, TI recommends using a 4-mil via at the center pad connected to the ground trace or plane on the bottom layer.

A power-supply bypass capacitor of 100 nF is recommended when supply output impedance is high, supply traces are long, or when excessive noise is expected on the supply lines. Bypass capacitors are also recommended when the comparator output drives a long trace or is required to drive a capacitive load. Due to the fast rising and falling edge rates and high-output sink and source capability of the TLV7011 and TLV7021 output stages, higher than normal quiescent current can be drawn from the power supply. Under this circumstance, the system would benefit from a bypass capacitor across the supply pins.