SLVSDM5F September   2017  – March 2020 TLV7011 , TLV7012 , TLV7021 , TLV7022

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
    1.     Device Images
      1.      X2SON Package vs SC70 and US Dime
      2.      Propagation Delay vs. Overdrive
  4. Revision History
  5. Pin Configuration and Functions
    1.     Pin Functions
    2.     Pin Functions: TLV7012/22
  6. Specifications
    1. 6.1  Absolute Maximum Ratings (Single)
    2. 6.2  Absolute Maximum Ratings (Dual)
    3. 6.3  ESD Ratings
    4. 6.4  Recommended Operating Conditions (Single)
    5. 6.5  Recommended Operating Conditions (Dual)
    6. 6.6  Thermal Information (Single)
    7. 6.7  Thermal Information (Dual)
    8. 6.8  Electrical Characteristics (Single)
    9. 6.9  Switching Characteristics (Single)
    10. 6.10 Electrical Characteristics (Dual)
    11. 6.11 Switching Characteristics (Dual)
    12. 6.12 Timing Diagrams
    13. 6.13 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
      1. 7.4.1 Inputs
      2. 7.4.2 Internal Hysteresis
      3. 7.4.3 Output
  8. Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Inverting Comparator With Hysteresis for TLV701x
      2. 8.1.2 Noninverting Comparator With Hysteresis for TLV701x
    2. 8.2 Typical Applications
      1. 8.2.1 Window Comparator
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curve
      2. 8.2.2 IR Receiver Analog Front End
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
        3. 8.2.2.3 Application Curve
      3. 8.2.3 Square-Wave Oscillator
        1. 8.2.3.1 Design Requirements
        2. 8.2.3.2 Detailed Design Procedure
        3. 8.2.3.3 Application Curve
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
        1. 11.1.1.1 Evaluation Module
    2. 11.2 Related Links
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Community Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Revision History

Changes from E Revision (October 2019) to F Revision

  • Added SOT-23 (8) and WSON (8) for dual channel optionsGo
  • Added SOT-23 (8) and WSON (8) Pin Functions and Package drawings for dual channel optionsGo
  • Added SOT-23 (8) and WSON (8) Thermal Tables for dual channel optionsGo

Changes from D Revision (February 2019) to E Revision

  • Added dual channel optionsGo

Changes from C Revision (March 2018) to D Revision

  • Added leaded package option to featuresGo
  • Deleted preview status of SOT23 packageGo
  • Deleted preview status of SOT23 packageGo

Changes from B Revision (November 2017) to C Revision

  • Changed the preview SC70 package to production dataGo

Changes from A Revision (July 2017) to B Revision

  • Changed propagation delay from: 200 ns to: 260 ns Go
  • Added preview SC70 and SOT-23 packages to the data sheet Go
  • Added TLV70x1 Family of Micropower Comparators table per marketing requestGo
  • Changed the key graphic title from: Propagation Delay vs. Overdrive (TLV7011) to: Propagation Delay vs. OverdriveGo
  • Removed (TLV7011 only) text from several Typical Characteristics graphsGo
  • Added Figure 7Go
  • Added Figure 10Go
  • Removed some Typical Characteristics graphs Go
  • Added content to the Inputs sectionGo
  • Added the IR Receiver Analog Front End sectionGo

Changes from * Revision (May 2017) to A Revision

  • Changed device status from ADVANCED INFO to PRODUCTION DATAGo