SLVSC35D August   2013  – July 2019 TLV702-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Typical Application
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagrams
    3. 7.3 Feature Description
      1. 7.3.1 Internal Current Limit
      2. 7.3.2 Shutdown
      3. 7.3.3 Dropout Voltage
      4. 7.3.4 Undervoltage Lockout
    4. 7.4 Device Functional Modes
      1. 7.4.1 Normal Operation
      2. 7.4.2 Dropout Operation
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Input and Output Capacitor Requirements
        2. 8.2.2.2 Transient Response
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
    1. 9.1 Power Dissipation
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Thermal Consideration
      2. 10.1.2 Package Mounting
    2. 10.2 Layout Examples
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
        1. 11.1.1.1 Spice Models
      2. 11.1.2 Device Nomenclature
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Community Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from C Revision (January 2018) to D Revision

  • Changed OUT pin number from 5 to 3 in DSE column of Pin Functions table Go
  • Added footnote to maximum EN voltage specification Go
  • Added parameter names to Recommended Operating Conditions tableGo

Changes from B Revision (June 2015) to C Revision

  • Added DBV package to documentGo
  • Changed Packages Features bullet to include DBV package Go
  • Added DBV package to Pin Configuration and Functions sectionGo
  • Added DBV column to Thermal Information tableGo
  • Changed title of Layout Example for the DDC and DBV Packages figure to include DBV packageGo

Changes from A Revision (August 2013) to B Revision

  • Added DSE (6-Pin WSON) package to data sheetGo
  • Added Device Information, ESD Ratings, and Recommended Operating Conditions tables, and Detailed Description, Application and Implementation, Power Supply Recommendations, Layout, Device and Documentation Support, and Mechanical, Packaging, and Orderable Information sections to data sheetGo
  • Deleted all references to P version of device throughout data sheetGo
  • Added "Over Temperature" to 2% accuracy Features bullet Go
  • Changed DDC package name from TSOT23 to SOT throughout data sheetGo
  • Changed Applications bulletsGo
  • Changed Description section textGo
  • Changed ceramic capacitor units on Typical Application circuit from mF to µF (typo) Go
  • Changed "free-air temperature" to "junction temperature" in Absolute Maximum Ratings condition statementGo
  • Added TJ to TA condition in Electrical Characteristics condition statementGo
  • Changed TA to TJ for typical values in Electrcial Characteristics condition statementGo