SLVSDM5F September   2017  – March 2020 TLV7011 , TLV7012 , TLV7021 , TLV7022

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      X2SON Package vs SC70 and US Dime
      2.      Propagation Delay vs. Overdrive
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
    2.     Pin Functions: TLV7012/22
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings (Single)
    2. 6.2  Absolute Maximum Ratings (Dual)
    3. 6.3  ESD Ratings
    4. 6.4  Recommended Operating Conditions (Single)
    5. 6.5  Recommended Operating Conditions (Dual)
    6. 6.6  Thermal Information (Single)
    7. 6.7  Thermal Information (Dual)
    8. 6.8  Electrical Characteristics (Single)
    9. 6.9  Switching Characteristics (Single)
    10. 6.10 Electrical Characteristics (Dual)
    11. 6.11 Switching Characteristics (Dual)
    12. 6.12 Timing Diagrams
    13. 6.13 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
      1. 7.4.1 Inputs
      2. 7.4.2 Internal Hysteresis
      3. 7.4.3 Output
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Inverting Comparator With Hysteresis for TLV701x
      2. 8.1.2 Noninverting Comparator With Hysteresis for TLV701x
    2. 8.2 Typical Applications
      1. 8.2.1 Window Comparator
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curve
      2. 8.2.2 IR Receiver Analog Front End
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
        3. 8.2.2.3 Application Curve
      3. 8.2.3 Square-Wave Oscillator
        1. 8.2.3.1 Design Requirements
        2. 8.2.3.2 Detailed Design Procedure
        3. 8.2.3.3 Application Curve
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
        1. 11.1.1.1 Evaluation Module
    2. 11.2 Related Links
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Community Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.10 Electrical Characteristics (Dual)

VS = 1.8 V to 5 V, VCM = VS / 2; minimum and maximum values are at TA = –40°C to +125°C (unless otherwise noted).
Typical values are at TA = 25°C.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VIO Input Offset Voltage VS = 1.8 V and 5 V, VCM = VS / 2 ±0.1 ±8 mV
VHYS Hysteresis VS = 1.8 V and 5 V, VCM = VS / 2 2 7.2 15 mV
VCM Common-mode voltage range VEE VCC + 0.1 V
IB Input bias current 2 pA
IOS Input offset current 1 pA
VOH Output voltage high (for TLV7012 only) VS = 5 V,  VEE = 0 V,  IO = 3 mA 4.65 4.8 V
VOL Output voltage low VS = 5 V, VEE = 0 V,  IO = 3 mA 250 350 mV
ILKG Open-drain output leakage
current (TLV7022 only)		 VS = 5 V, VID = +0.1 V (output high),
VPULLUP = VCC 		100 pA
CMRR Common-mode rejection ratio VEE < VCM < VCC, VS = 5 V 73 dB
PSRR Power supply rejection ratio VS = 1.8 V to 5 V, VCM = VS / 2 77 dB
ISC Short-circuit current VS = 5 V, sourcing (for TLV7012 only) 29 mA
VS = 5 V, sinking 33
ICC Supply current / Channel VS = 1.8 V, no load, VID = –0.1 V (Output Low) 4.7 9 µA