SBVS305 March   2017 TLV703

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Internal Current Limit
      2. 7.3.2 Shutdown
      3. 7.3.3 Dropout Voltage
      4. 7.3.4 Undervoltage Lockout (UVLO)
    4. 7.4 Device Functional Modes
      1. 7.4.1 Normal Operation
      2. 7.4.2 Dropout Operation
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Input and Output Capacitor Requirements
        2. 8.2.2.2 Transient Response
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
    1. 9.1 Power Dissipation
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 Thermal Consideration
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
      2. 11.1.2 Device Nomenclature
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Community Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6 Specifications

6.1 Absolute Maximum Ratings

over operating junction temperature range (unless otherwise noted)(1)
MIN MAX UNIT
Voltage(2) IN, EN, OUT –0.3 6 V
Current (source) OUT Internally limited
Output short-circuit duration Indefinite
Total continuous power dissipation See Thermal Information
Temperature Operating virtual junction, TJ –55 150 °C
Storage, Tstg –55 150
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods my affect device reliability.
(2) All voltages are with respect to the network ground terminal.

6.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V
Charged device model (CDM), per JEDEC specification JESD22-C101(2) ±500
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)
MIN NOM MAX UNIT
VIN Input voltage range 2 5.5 V
VOUT Output voltage range 1.2 4.8 V
IOUT Output current 0 300 mA

6.4 Thermal Information

THERMAL METRIC(1) TLV703 UNIT
DBV (SOT-23)
5 PINS
RθJA Junction-to-ambient thermal resistance 254.1 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 143.9  °C/W
RθJB Junction-to-board thermal resistance 58.0  °C/W
ψJT Junction-to-top characterization parameter 25.3  °C/W
ψJB Junction-to-board characterization parameter 56.6  °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.

6.5 Electrical Characteristics

at VIN = VOUT(nom) + 0.5 V or 2 V (whichever is greater), IOUT = 10 mA, VEN = 0.9 V, COUT = 1 μF, and TJ = –40°C to +125°C (unless otherwise noted); typical values are at TJ = 25°C
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VIN Input voltage range 2 5.5 V
VOUT DC output accuracy –40°C ≤ TJ ≤ 125°C –2% 0.5% 2%
ΔVOUT(ΔVIN) Line regulation VOUT(nom) + 0.5 V ≤ VIN ≤ 5.5 V,
IOUT = 10 mA		 1 5 mV
ΔVOUT(ΔIOUT) Load regulation 0 mA ≤ IOUT ≤ 300 mA 1 15 mV
VDO Dropout voltage(1) VIN = 0.98 × VOUT(nom), IOUT = 300 mA 260 375 mV
ICL Output current limit VOUT = 0.9 × VOUT(nom) 320 500 860 mA
IGND Ground pin current IOUT = 0 mA 35 55 µA
IOUT = 300 mA, VIN = VOUT + 0.5 V 370
ISHDN Ground pin current (shutdown) VEN ≤ 0.4 V, VIN = 2 V 400 nA
VEN ≤ 0.4 V, 2 V ≤ VIN ≤ 4.5 V,
TJ = –40°C to +85°C		 1 2 µA
PSRR Power-supply rejection ratio VIN = 2.3 V, VOUT = 1.8 V,
IOUT = 10 mA, f = 1 kHz		 68 dB
Vn Output noise voltage BW = 100 Hz to 100 kHz,
VIN = 2.3 V, VOUT = 1.8 V, IOUT = 10 mA		 48 µVRMS
tSTR Start-up time(2) COUT = 1 µF, IOUT = 300 mA 100 µs
VEN(high) Enable pin high (enabled) 0.9 VIN V
VEN(low) Enable pin low (disabled) 0 0.4 V
IEN Enable pin current VIN = VEN = 5.5 V 0.04 µA
UVLO Undervoltage lockout VIN rising 1.9 V
Tsd Thermal shutdown temperature Shutdown, temperature increasing 165 °C
Reset, temperature decreasing 145
TJ Operating junction temperature –40 125 °C
(1) VDO is measured for devices with VOUT(nom) ≥ 2.35 V.
(2) Start-up time = time from EN assertion to 0.98 × VOUT(nom).

6.6 Typical Characteristics

over operating temperature range (TJ = –40°C to +125°C), VIN = VOUT(nom) + 0.5 V or 2 V, whichever is greater, IOUT = 10 mA, VEN = VIN, COUT = 1 μF (unless otherwise noted); typical values are at TJ = 25°C
TLV703 tc_line_reg_10ma_sbvs305.gif
VOUT = 1.8 V, IOUT = 10 mA
Figure 1. Line Regulation
TLV703 tc_load_reg_sbvs305.gif
VOUT = 1.8 V
Figure 3. Load Regulation
TLV703 tc_vout-tmp_sbvs305.gif
VOUT = 1.8 V
Figure 5. Output Voltage vs Temperature
TLV703 tc_ignd_iout_sbvs305.gif
VOUT = 1.8 V
Figure 7. Ground Pin Current vs Load
TLV703 tc_ishdn-vin_sbvs305.gif
VOUT = 1.8 V
Figure 9. Shutdown Current vs Input Voltage
TLV703 tc_psrr_fqcy_05v_sbvs305.gif
VIN – VOUT = 0.5 V
Figure 11. Power-Supply Ripple Rejection vs Frequency
TLV703 tc_noise-frq_sbvs305.gif
VOUT = 1.8 V, IOUT = 10 mA, CIN = COUT = 1 µF
Figure 13. Output Spectral Noise Density vs Frequency
TLV703 tc_load_tran_10_sbvs305.gif
VOUT = 1.8 V, tR = tF = 1 µs
Figure 15. Load Transient Response
TLV703 tc_load_tran_300_sbvs305.gif
VOUT = 1.8 V, tR = tF = 1 µs
Figure 17. Load Transient Response
TLV703 tc_line_tran_1ma_sbvs305.gif
VOUT = 1.8 V, IOUT = 1 mA, slew rate = 1 V/µs
Figure 19. Line Transient Response
TLV703 tc_ramp_up_down_sbvs305.gif
VOUT = 1.8 V, IOUT = 1 mA
Figure 21. VIN Ramp Up, Ramp Down Response
TLV703 tc_line_reg_300ma_sbvs305.gif
VOUT = 1.8 V, IOUT = 300 mA
Figure 2. Line Regulation
TLV703 tc_vdo_vin_sbvs305.gif
IOUT = 300 mA
Figure 4. Dropout Voltage vs Input Voltage
TLV703 tc_ignd_vin_sbvs305.gif
VOUT = 1.8 V
Figure 6. Ground Pin Current vs Input Voltage
TLV703 tc_ignd-tmp_sbvs305.gif
VOUT = 1.8 V
Figure 8. Ground Pin Current vs Temperature
TLV703 tc_ilim-vin_sbvs305.gif
VOUT = 1.8 V
Figure 10. Current Limit vs Input Voltage
TLV703 tc_psrr-vin_sbvs305.gif
VOUT = 1.8 V
Figure 12. Power-Supply Ripple Rejection vs Input Voltage
TLV703 tc_load_tran_200_sbvs305.gif
VOUT = 1.8 V
Figure 14. Load Transient Response
TLV703 tc_load_tran_50_sbvs305.gif
VOUT = 1.8 V, tR = tF = 1 µs
Figure 16. Load Transient Response
TLV703 tc_line_tran_300ma_sbvs305.gif
VOUT = 1.8 V, IOUT = 300 mA, slew rate = 1 V/µs
Figure 18. Line Transient Response
TLV703 tc_line_tran_55v_sbvs305.gif
VOUT = 1.8 V, IOUT = 300 mA, slew rate = 1 V/µs
Figure 20. Line Transient Response