SBVS148F September   2010  – March 2023 TLV704

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4.     Thermal Information
    5. 6.4 Electrical Characteristics
    6. 6.5 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Wide Supply Range
      2. 7.3.2 Low Quiescent Current
      3. 7.3.3 Dropout Voltage (VDO)
      4. 7.3.4 Current Limit
    4. 7.4 Device Functional Modes
      1. 7.4.1 Normal Operation
      2. 7.4.2 Dropout Operation
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 External Capacitor Requirements
        2. 8.2.2.2 Input and Output Capacitor Requirements
        3. 8.2.2.3 Reverse Current
        4. 8.2.2.4 Power Dissipation (PD)
        5. 8.2.2.5 Estimating Junction Temperature
      3. 8.2.3 Application Curves
    3. 8.3 Best Design Practices
    4. 8.4 Power Supply Recommendations
    5. 8.5 Layout
      1. 8.5.1 Layout Guidelines
        1. 8.5.1.1 Power Dissipation
      2. 8.5.2 Layout Example
  9. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Development Support
        1. 9.1.1.1 Evaluation Module
      2. 9.1.2 Device Nomenclature
    2. 9.2 Documentation Support
      1. 9.2.1 Related Documentation
    3. 9.3 Receiving Notification of Documentation Updates
    4. 9.4 Support Resources
    5. 9.5 Trademarks
    6. 9.6 Electrostatic Discharge Caution
    7. 9.7 Glossary
  10. 10Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DBV|5
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from Revision E (December 2022) to Revision F (March 2023)

  • Changed fixed output options to show the range of options instead of each individually in Features sectionGo
  •  Corrected the abs max rating of VOUT pin for legacy chip Go
  •  Corrected the operating max range of VOUT pinGo
  •  Corrected the supported output current range from 50 mA to 150 mAGo
  • Changed Application Curves sectionGo
  • Added Application Curves section back to publicationGo

Changes from Revision D (January 2015) to Revision E (December 2022)

  • Changed document title, Features, Applications, and Description sections and added M3 device information to documentGo
  • Changed Pin Configuration and Functions sectionGo
  • Changed capacitor value from 1 μF to 0.47 µF is OUT pin description in Pin Functions tableGo
  • Added new chip specific curves to Typical Characteristics sectionGo
  • Changed Overview sectionGo
  • Changed Functional Block Diagram imageGo
  • Changed Feature Description sectionGo
  • Deleted thermal shutdown discussion from Current Limit sectionGo
  • Changed Normal Operation sectionGo
  • Changed Dropout Operation sectionGo
  • Changed Application Information sectionGo
  • Added External Capacitor Requirements, Reverse Current, and Power Dissipation sub-sections to Detailed Design Procedure sectionGo
  • Changed Input and Output Capacitor Requirements sectionGo
  • Added Reverse Current sectionGo
  • Changed Estimating Junction Temperature sectionGo
  • Added Best Design Practices sectionGo
  • Changed Power Supply Recommendations sectionGo
  • Changed Layout Guidelines sectionGo
  • Changed Power Dissipation section: changed title and deleted last sentence from sectionGo
  • Added M3 row to Available Options tableGo