SBVS148F September   2010  – March 2023 TLV704

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4.     Thermal Information
    5. 6.4 Electrical Characteristics
    6. 6.5 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Wide Supply Range
      2. 7.3.2 Low Quiescent Current
      3. 7.3.3 Dropout Voltage (VDO)
      4. 7.3.4 Current Limit
    4. 7.4 Device Functional Modes
      1. 7.4.1 Normal Operation
      2. 7.4.2 Dropout Operation
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 External Capacitor Requirements
        2. 8.2.2.2 Input and Output Capacitor Requirements
        3. 8.2.2.3 Reverse Current
        4. 8.2.2.4 Power Dissipation (PD)
        5. 8.2.2.5 Estimating Junction Temperature
      3. 8.2.3 Application Curves
    3. 8.3 Best Design Practices
    4. 8.4 Power Supply Recommendations
    5. 8.5 Layout
      1. 8.5.1 Layout Guidelines
        1. 8.5.1.1 Power Dissipation
      2. 8.5.2 Layout Example
  9. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Development Support
        1. 9.1.1.1 Evaluation Module
      2. 9.1.2 Device Nomenclature
    2. 9.2 Documentation Support
      1. 9.2.1 Related Documentation
    3. 9.3 Receiving Notification of Documentation Updates
    4. 9.4 Support Resources
    5. 9.5 Trademarks
    6. 9.6 Electrostatic Discharge Caution
    7. 9.7 Glossary
  10. 10Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DBV|5
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9.1.2 Device Nomenclature

Table 9-1 Available Options(1)
PRODUCT VOUT
TLV704xxyyyz

Legacy chip
xx is the nominal output voltage (for example 33 = 3.3 V).
yyy is the package designator.
z is the package quantity.
TLV704xxyyyzM3

New chip
xx is the nominal output voltage (for example 33 = 3.3 V).
yyy is the package designator.
z is the package quantity.M3 is a suffix designator for newer chip redesigns, fabricated on the latest TI process technology.
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or visit the device product folder at www.ti.com.