SLVSE13J September   2017  – November 2024 TLV7031 , TLV7032 , TLV7034 , TLV7041 , TLV7042 , TLV7044

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
    1. 4.1 Pin Functions: TLV7031/41 Singles including "S" and "L" options
    2. 4.2 Pin Functions: TLV7032/42 Dual
    3. 4.3 Pin Functions: TLV7034/44 Quad
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information (Single)
    5. 5.5  Thermal Information (Dual)
    6. 5.6  Thermal Information (Quad)
    7. 5.7  Electrical Characteristics (Single)
    8. 5.8  Switching Characteristics (Single)
    9. 5.9  Electrical Characteristics (Dual)
    10. 5.10 Switching Characteristics (Dual)
    11. 5.11 Electrical Characteristics (Quad)
    12. 5.12 Switching Characteristics (Quad)
    13. 5.13 Timing Diagrams
    14. 5.14 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
    4. 6.4 Device Functional Modes
      1. 6.4.1 Inputs
      2. 6.4.2 Internal Hysteresis
      3. 6.4.3 Output
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Inverting Comparator With Hysteresis for TLV703x
      2. 7.1.2 Non-Inverting Comparator With Hysteresis for TLV703x
    2. 7.2 Typical Applications
      1. 7.2.1 Window Comparator
        1. 7.2.1.1 Design Requirements
        2. 7.2.1.2 Detailed Design Procedure
        3. 7.2.1.3 Application Curve
      2. 7.2.2 IR Receiver Analog Front End
        1. 7.2.2.1 Design Requirements
        2. 7.2.2.2 Detailed Design Procedure
        3. 7.2.2.3 Application Curve
      3. 7.2.3 Square-Wave Oscillator
        1. 7.2.3.1 Design Requirements
        2. 7.2.3.2 Detailed Design Procedure
        3. 7.2.3.3 Application Curve
      4. 7.2.4 Quadrature Rotary Encoder
        1. 7.2.4.1 Design Requirements
        2. 7.2.4.2 Detailed Design Procedure
        3. 7.2.4.3 Application Curve
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Development Support
        1. 8.1.1.1 Evaluation Module
    2. 8.2 Documentation Support
      1. 8.2.1 Related Documentation
    3. 8.3 Receiving Notification of Documentation Updates
    4. 8.4 Support Resources
    5. 8.5 Trademarks
    6. 8.6 Electrostatic Discharge Caution
    7. 8.7 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.5 Thermal Information (Dual)

THERMAL METRIC(1)TLV7032/TLV7042UNIT
DGK (VSSOP)DDF (SOT-23)DSG (WSON)
8 PINS8 PINS8 PINS
RθJAJunction-to-ambient thermal resistance211.7212.5106.1°C/W
RθJC(top)Junction-to-case (top) thermal resistance96.1127.3127.3°C/W
RθJBJunction-to-board thermal resistance133.5129.272.5°C/W
ΨJTJunction-to-top characterization parameter28.325.816.8°C/W
ΨJBJunction-to-board characterization parameter131.7129.072.2°C/W
RθJC(bot)Junction-to-case (bottom) thermal resistanceN/AN/A47.6°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.