SLVSE13J September   2017  – November 2024 TLV7031 , TLV7032 , TLV7034 , TLV7041 , TLV7042 , TLV7044

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
    1. 4.1 Pin Functions: TLV7031/41 Singles including "S" and "L" options
    2. 4.2 Pin Functions: TLV7032/42 Dual
    3. 4.3 Pin Functions: TLV7034/44 Quad
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information (Single)
    5. 5.5  Thermal Information (Dual)
    6. 5.6  Thermal Information (Quad)
    7. 5.7  Electrical Characteristics (Single)
    8. 5.8  Switching Characteristics (Single)
    9. 5.9  Electrical Characteristics (Dual)
    10. 5.10 Switching Characteristics (Dual)
    11. 5.11 Electrical Characteristics (Quad)
    12. 5.12 Switching Characteristics (Quad)
    13. 5.13 Timing Diagrams
    14. 5.14 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
    4. 6.4 Device Functional Modes
      1. 6.4.1 Inputs
      2. 6.4.2 Internal Hysteresis
      3. 6.4.3 Output
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Inverting Comparator With Hysteresis for TLV703x
      2. 7.1.2 Non-Inverting Comparator With Hysteresis for TLV703x
    2. 7.2 Typical Applications
      1. 7.2.1 Window Comparator
        1. 7.2.1.1 Design Requirements
        2. 7.2.1.2 Detailed Design Procedure
        3. 7.2.1.3 Application Curve
      2. 7.2.2 IR Receiver Analog Front End
        1. 7.2.2.1 Design Requirements
        2. 7.2.2.2 Detailed Design Procedure
        3. 7.2.2.3 Application Curve
      3. 7.2.3 Square-Wave Oscillator
        1. 7.2.3.1 Design Requirements
        2. 7.2.3.2 Detailed Design Procedure
        3. 7.2.3.3 Application Curve
      4. 7.2.4 Quadrature Rotary Encoder
        1. 7.2.4.1 Design Requirements
        2. 7.2.4.2 Detailed Design Procedure
        3. 7.2.4.3 Application Curve
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Development Support
        1. 8.1.1.1 Evaluation Module
    2. 8.2 Documentation Support
      1. 8.2.1 Related Documentation
    3. 8.3 Receiving Notification of Documentation Updates
    4. 8.4 Support Resources
    5. 8.5 Trademarks
    6. 8.6 Electrostatic Discharge Caution
    7. 8.7 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9 Revision History

Changes from Revision I (June 2024) to Revision J (November 2024)

  • Updated "S" and "L" text and supply votlageGo
  • Added 1.2V Recommended Min Supply for "S" and "L" devicesGo

Changes from Revision H (July 2021) to Revision I (June 2024)

  • Added package variants TLV70x1L and TLV70xSGo

Changes from Revision G (Nov 2020) to Revision H (July 2021)

  • Releasing TSSOP package optionGo

Changes from Revision F (November 2019) to Revision G (December 2020)

  • Updated the numbering format for tables, figures, and cross-references throughout the document Go
  • Added SOT-23 (8) and WSON (8) for dual channel optionsGo

Changes from Revision E (June 2019) to Revision F (November 2019)

  • Added quad channel versionsGo
  • Added SOT-23 (8) and WSON (8) for dual channel options Go
  • Added QUAD package optionsGo
  • Added TSSOP and RTE pinout information to Pin Configuration and Functions section Go

Changes from Revision D (April 2019) to Revision E (June 2019)

  • Changed VOH min from 4.7V to 4.65V for all package options in EC Table (Single) Go
  • Changed VOL max from 300mV to 350mV for all package options in EC Table (Single) Go
  • Deleted separate rows for VOH & VOL for DBV package options only in EC Table (Single) Go

Changes from Revision C (March 2019) to Revision D (April 2019)

  • Added separate rows for VOH & VOL for DBV package options in EC Table (Single) Go

Changes from Revision B (May 2018) to Revision C (March 2019)

  • Added dual channel versions in VSSOP packageGo
  • Changed TLV7031 to TLV703x and TLV7041 to TLV704x throughout the document Go
  • Added dual channel versionsGo
  • Added Device Information dual channel versions in VSSOP packageGo
  • Deleted The SOT-23 package is in preview onlyGo

Changes from Revision A (January 2018) to Revision B (May 2018)

  • Changed the preview SC70 package to production dataGo

Changes from Revision * (September 2017) to Revision A (January 2018)

  • Changed data sheet title from: TLV7031/TLV7041 Small-Size, nanoPower, Low-Voltage Comparators to: TLV7031 and TLV7041 Small Size, nanopower, Low-Voltage Comparators Go
  • Added Internal Hysteresis bullet to Features Go
  • Specified which device has push-pull output and open-drain output options in Features Go
  • Removed (TLV7031) from key graphic title because the graph covers both the TLV7031 and TLV7041 devicesGo
  • Added X2SON tablenote to Pin Functions table Go
  • Changed Figure 5-2 Go
  • Added note to the Timing Diagrams sectionGo
  • Smoothed Propagation Delay plots in Figure 5-31 through Go
  • Changed vertical labels on Figure 5-20, Figure 5-21, Figure 5-17, and Figure 5-30 Go
  • Changed Functional Block Diagram Go
  • Changed text '...external source up to 7V to 6.5V'Go
  • Changed Figure 7-3 Go
  • Added note to the Layout Example sectionGo
  • Added Documentation Support section Go