SLVSE13I September 2017 – June 2024 TLV7031 , TLV7032 , TLV7034 , TLV7041 , TLV7042 , TLV7044
PRODUCTION DATA
THERMAL METRIC(1) | TLV7031/TLV7041 | UNIT | |||
---|---|---|---|---|---|
DPW (X2SON) | DBV (SOT-23) | DCK (SC70) | |||
5 PINS | 5 PINS | 5 PINS | |||
RθJA | Junction-to-ambient thermal resistance | 533.2 | 297.2 | 278.8 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 302.7 | 224.7 | 186.6 | °C/W |
RθJB | Junction-to-board thermal resistance | 408.3 | 200.1 | 113.2 | °C/W |
ΨJT | Junction-to-top characterization parameter | 71.5 | 141.2 | 82.3 | °C/W |
ΨJB | Junction-to-board characterization parameter | 405.9 | 198.9 | 112.4 | °C/W |
RθJC(bot) | Junction-to-case (bottom) thermal resistance | 188.3 | N/A | N/A | °C/W |