SBVS266
May 2015
TLV713P-Q1
PRODUCTION DATA.
1
Features
2
Applications
3
Description
4
Revision History
5
Pin Configurations and Functions
6
Specifications
6.1
Absolute Maximum Ratings
6.2
ESD Ratings
6.3
Recommended Operating Conditions
6.4
Thermal Information
6.5
Electrical Characteristics
6.6
Typical Characteristics
7
Detailed Description
7.1
Overview
7.2
Functional Block Diagram
7.3
Feature Description
7.3.1
Undervoltage Lockout (UVLO)
7.3.2
Shutdown
7.3.3
Foldback Current Limit
7.3.4
Thermal Protection
7.4
Device Functional Modes
7.4.1
Normal Operation
7.4.2
Dropout Operation
7.4.3
Disabled
8
Application and Implementation
8.1
Application Information
8.1.1
Input and Output Capacitor Considerations
8.1.2
Dropout Voltage
8.1.3
Transient Response
8.2
Typical Application
8.2.1
Design Requirements
8.2.2
Detailed Design Procedure
8.2.3
Application Curves
8.3
Do's and Don'ts
9
Power-Supply Recommendations
10
Layout
10.1
Layout Guidelines
10.1.1
Board Layout Recommendations to Improve PSRR and Noise Performance
10.2
Layout Example
10.3
Power Dissipation
11
Device and Documentation Support
11.1
Device Support
11.1.1
Development Support
11.1.1.1
Evaluation Modules
11.1.1.2
Spice Models
11.1.2
Device Nomenclature
11.2
Documentation Support
11.2.1
Related Documentation
11.3
Community Resources
11.4
Trademarks
11.5
Electrostatic Discharge Caution
11.6
Glossary
12
Mechanical, Packaging, and Orderable Information
Package Options
Mechanical Data (Package|Pins)
DBV|5
MPDS018T
Thermal pad, mechanical data (Package|Pins)
Orderable Information
sbvs266_oa
sbvs266_pm
4 Revision History
DATE
REVISION
NOTES
May 2015
*
Initial release.