The TLV740P low-dropout (LDO) linear regulator is a low quiescent current LDO with excellent line and load transient performance designed for power-sensitive applications. This device provides a typical accuracy of 1%.
The TLV740P also provides inrush current control during device power up and enabling. The TLV740P limits the input current to the defined current limit to avoid large currents from flowing from the input power source. This functionality is especially important in battery-operated devices.
The TLV740P is available in standard DQN and DBV packages. The TLV740P also provides an active pulldown circuit to quickly discharge output loads.
DEVICE NAME | PACKAGE | BODY SIZE |
---|---|---|
TLV740P | SOT-23 (5) | 2.90 mm × 1.60 mm |
X2SON (4) | 1.00 mm × 1.00 mm |
Changes from Revision * (June 2020) to Revision A (December 2020)
PIN | I/O | DESCRIPTION | ||
---|---|---|---|---|
NAME | NO. | |||
X2SON | SOT-23 | |||
EN | 3 | 3 | I | Enable pin. Driving this pin to logic high enables the device; driving this pin to logic low disables the device. Do not float this pin. If not used, connect EN to IN. |
GND | 2 | 2 | — | Ground pin. This pin must be connected to ground on the board. |
IN | 4 | 1 | I | Input pin. For best transient response and to minimize input impedance, use the recommended value or larger ceramic capacitor from IN to ground; see the Recommended Operating Conditions table. Place the input capacitor as close to the input of the device as possible. |
NC | — | 4 | — | No connect pin. This pin is not internally connected. Connect to ground for best thermal performance or leave floating. |
OUT | 1 | 5 | O | Regulated output pin. A 1-µF or greater effective capacitance is required from OUT to ground for stability. see the Recommended Operating Conditions table. For best transient response, use a 1-µF or larger ceramic capacitor from OUT to ground. Place the output capacitor as close to output of the device as possible. |
Thermal pad | — | — | The thermal pad is electrically connected to the GND pin. Connect the thermal pad to a large-area GND plane for improved thermal performance. |