Place input and output capacitors as close to the device as possible.
Use copper planes for device connections, in order to optimize thermal performance.
Place thermal vias around the device to distribute the heat.
Only place tented thermal vias directly beneath the thermal pad of the DQN package. An untented via can wick solder or solder paste away from the thermal pad joint during the soldering process, leading to a compromised solder joint on the thermal pad.