The TLV741P low-dropout linear regulator (LDO) is a low quiescent current device with excellent line and load transient performance for power-sensitive applications. This device provides a typical accuracy of 1%.
The TLV741P is designed to be stable with a small, 1-µF output capacitor.
The TLV741P provides inrush current control during device power up and enabling. The TLV741P limits the input current to the defined current limit to avoid large currents from flowing from the input power source. This functionality is especially important in battery-operated devices.
The TLV741P is available in standard DBV (SOT-23) and DQN (X2SON) packages. The TLV741P provides an active pulldown circuit to quickly discharge output loads.
DEVICE NAME | PACKAGE | BODY SIZE |
---|---|---|
TLV741P | SOT-23 (5) | 2.90 mm × 1.60 mm |
X2SON (4) | 1.00 mm × 1.00 mm |
Changes from * Revision (July 2017) to A Revision
PIN | I/O | DESCRIPTION | ||
---|---|---|---|---|
NAME | NO. | |||
SOT-23 | X2SON | |||
EN | 3 | 3 | I | Enable pin. Driving EN over 0.9 V turns on the regulator.
Driving EN below 0.4 V puts the regulator into shutdown mode. |
GND | 2 | 2 | — | Ground pin |
IN | 1 | 4 | I | Input pin. Use a small capacitor from this pin to ground. See the Input and Output Capacitor Considerations section for more details. |
NC | 4 | — | — | No internal connection |
OUT | 5 | 1 | O | Regulated output voltage pin. For best transient response, use a small 1-µF ceramic capacitor from this pin to ground. See the Input and Output Capacitor Considerations section for more details. |
Thermal pad | — | — | — | The thermal pad is electrically connected to the GND node. Connect the thermal pad to the ground plane for improved thermal performance. |