SBVS385B December   2019  – April 2020 TLV751

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Typical Application
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Undervoltage Lockout (UVLO)
      2. 7.3.2 Shutdown
      3. 7.3.3 Foldback Current Limit
      4. 7.3.4 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Device Functional Mode Comparison
      2. 7.4.2 Normal Operation
      3. 7.4.3 Dropout Operation
      4. 7.4.4 Disabled
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Adjustable Device Feedback Resistors
      2. 8.1.2 Input and Output Capacitor Selection
      3. 8.1.3 Dropout Voltage
      4. 8.1.4 Exiting Dropout
      5. 8.1.5 Reverse Current
      6. 8.1.6 Power Dissipation (PD)
      7. 8.1.7 Feed-Forward Capacitor (CFF)
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Input Current
        2. 8.2.2.2 Thermal Dissipation
      3. 8.2.3 Application Curve
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Device Nomenclature
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

3 Description

The TLV751 is a dual, adjustable, 500-mA low-dropout (LDO) regulator. This device is available in a small, 10-pin, 2-mm × 2-mm WSON package and consumes 25-µA quiescent current while providing fast line and load transient response. The TLV751 features an low dropout of 130 mV that can help improve the overall power efficiency.

The TLV751 wide input-and-output voltage ranges, when combined with its output current capability in a small printed circuit board (PCB) footprint help support a wide variety of applications from sensor supplies, to auxiliary rails, and modern microcontrollers with lower core voltages.

The TLV751 is stable with small ceramic output capacitors, allowing for a small overall solution size. A precision band-gap and error amplifier provides high accuracy of 1.5% (max) over temperature. This device includes integrated thermal shutdown, current limit, active output-discharge, and undervoltage lockout (UVLO) features. The TLV751 has an internal fold-back current-limit to reduce thermal dissipation during short-circuit events.

Device Information(1)

PART NUMBER PACKAGE BODY SIZE (NOM)
TLV751 WSON (10) 2.00 mm × 2.00 mm
  1. For all available packages, see the orderable addendum at the end of the data sheet.
  2. Preview device.