SBVS383A
December 2019 – March 2020
TLV752
PRODUCTION DATA.
1
Features
2
Applications
3
Description
Device Images
Typical Application
4
Revision History
5
Pin Configuration and Functions
Pin Functions
6
Specifications
6.1
Absolute Maximum Ratings
6.2
ESD Ratings
6.3
Recommended Operating Conditions
6.4
Thermal Information
6.5
Electrical Characteristics
6.6
Typical Characteristics
7
Detailed Description
7.1
Overview
7.2
Functional Block Diagram
7.3
Feature Description
7.3.1
Undervoltage Lockout (UVLO)
7.3.2
Shutdown
7.3.3
Foldback Current Limit
7.3.4
Thermal Shutdown
7.4
Device Functional Modes
7.4.1
Device Functional Mode Comparison
7.4.2
Normal Operation
7.4.3
Dropout Operation
7.4.4
Disabled
8
Application and Implementation
8.1
Application Information
8.1.1
Adjustable Device Feedback Resistors
8.1.2
Input and Output Capacitor Selection
8.1.3
Dropout Voltage
8.1.4
Exiting Dropout
8.1.5
Reverse Current
8.1.6
Power Dissipation (PD)
8.1.7
Feed-Forward Capacitor (CFF)
8.2
Typical Application
8.2.1
Design Requirements
8.2.2
Detailed Design Procedure
8.2.2.1
Input Current
8.2.2.2
Thermal Dissipation
8.2.3
Application Curve
9
Power Supply Recommendations
10
Layout
10.1
Layout Guidelines
10.2
Layout Example
11
Device and Documentation Support
11.1
Device Support
11.1.1
Device Nomenclature
11.2
Documentation Support
11.2.1
Related Documentation
11.3
Receiving Notification of Documentation Updates
11.4
Community Resources
11.5
Trademarks
11.6
Electrostatic Discharge Caution
11.7
Glossary
12
Mechanical, Packaging, and Orderable Information
Package Options
Mechanical Data (Package|Pins)
DSQ|10
MPDS335B
Thermal pad, mechanical data (Package|Pins)
Orderable Information
sbvs383a_oa
sbvs383a_pm
10.2
Layout Example
Figure 46.
Layout Example for the DSQ Package