SBVS320D November   2017  – September 2024 TLV755P

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Undervoltage Lockout (UVLO)
      2. 6.3.2 Enable (EN)
      3. 6.3.3 Internal Foldback Current Limit
      4. 6.3.4 Thermal Shutdown
    4. 6.4 Device Functional Modes
      1. 6.4.1 Normal Operation
      2. 6.4.2 Dropout Operation
      3. 6.4.3 Disabled
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Input and Output Capacitor Selection
      2. 7.1.2 Dropout Voltage
      3. 7.1.3 Exiting Dropout
      4. 7.1.4 Reverse Current
      5. 7.1.5 Power Dissipation (PD)
        1. 7.1.5.1 Estimating Junction Temperature
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 Input Current
        2. 7.2.2.2 Thermal Dissipation
      3. 7.2.3 Application Curve
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Examples
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Device Nomenclature
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DYD|5
  • DBV|5
  • DQN|4
  • DRV|6
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.6 Typical Characteristics

at operating temperature TJ = 25°C, VIN = VOUT(NOM) + 0.5V or 1.45V (whichever is greater), IOUT = 1mA, VEN = VIN, and CIN = COUT = 1µF (unless otherwise noted)

TLV755P PSRR vs Frequency and IOUT
VIN = 4.3V, VOUT = 3.3V, COUT = 1µF
Figure 5-1 PSRR vs Frequency and IOUT
TLV755P PSRR vs Frequency and COUT
VIN = 4.3V, VOUT = 3.3V, IOUT = 500mA
Figure 5-3 PSRR vs Frequency and COUT
TLV755P Output Spectral Noise Density vs Frequency and IOUT
VOUT = 3.3V, IOUT = 500mA, COUT = 1µF, VRMS BW = 10Hz to 100kHz
Figure 5-5 Output Spectral Noise Density vs Frequency and IOUT
TLV755P Line Transient
VOUT = 3.3V, COUT = 1µF, VIN slew rate = 1V/µs
Figure 5-7 Line Transient
TLV755P VIN = VEN Power-Up
 
Figure 5-9 VIN = VEN Power-Up
TLV755P EN Start-Up
VIN = 5V, IOUT = 100mA, VEN slew rate = 1V/µs,
VOUT = 3.3V
Figure 5-11 EN Start-Up
TLV755P 3.3V Dropout Voltage vs IOUT
 
Figure 5-13 3.3V Dropout Voltage vs IOUT
TLV755P 3.3V Regulation vs VIN (Line Regulation)
VOUT = 3.3V, IOUT = 1mA
Figure 5-15 3.3V Regulation vs VIN (Line Regulation)
TLV755P IGND vs IOUT
 
Figure 5-17 IGND vs IOUT
TLV755P IQ vs VIN
VOUT = 3.3V, IOUT = 0mA
Figure 5-19 IQ vs VIN
TLV755P ISHDN vs Temperature
VEN = 0V
Figure 5-21 ISHDN vs Temperature
TLV755P IEN vs VIN
VEN = 5.5V
Figure 5-23 IEN vs VIN
TLV755P VOUT vs IOUT Pulldown Resistor
 
Figure 5-25 VOUT vs IOUT Pulldown Resistor
TLV755P PSRR vs Frequency and VIN
VOUT = 3.3V, COUT = 1µF, IOUT = 500mA
Figure 5-2 PSRR vs Frequency and VIN
TLV755P Output Spectral Noise Density vs Frequency and COUT
VOUT = 3.3V, VRMS BW = 10Hz to 100kHz
Figure 5-4 Output Spectral Noise Density vs Frequency and COUT
TLV755P Output Noise Voltage vs VOUT
IOUT = 500mA, COUT = 1µF, VRMS BW = 10Hz to 100kHz
 
Figure 5-6 Output Noise Voltage vs VOUT
TLV755P 3.3V, 1mA to 500mA Load Transient
VIN = 5V, VOUT = 3.3V, COUT = 1µF, IOUT slew rate = 1A/µs
Figure 5-8 3.3V, 1mA to 500mA Load Transient
TLV755P VIN = VEN Shutdown
 
Figure 5-10 VIN = VEN Shutdown
TLV755P Load Regulation vs IOUT
 
 
Figure 5-12 Load Regulation vs IOUT
TLV755P 5.0V Dropout Voltage vs IOUT
 
Figure 5-14 5.0V Dropout Voltage vs IOUT
TLV755P 5.0V Accuracy vs VIN (Line Regulation)
IOUT = 1mA, VOUT = 5V
Figure 5-16 5.0V Accuracy vs VIN (Line Regulation)
TLV755P IGND vs VIN
VOUT = 3.3V, IOUT = 1mA
Figure 5-18 IGND vs VIN
TLV755P ISHDN vs VIN
VEN = 0V
Figure 5-20 ISHDN vs VIN
TLV755P Enable Threshold vs Temperature
 
Figure 5-22 Enable Threshold vs Temperature
TLV755P UVLO Threshold vs Temperature
 
Figure 5-24 UVLO Threshold vs Temperature
TLV755P 3.3V Foldback Current Limit, VOUT vs IOUT
 
Figure 5-26 3.3V Foldback Current Limit, VOUT vs IOUT