SBVS351D April   2018  – October 2023 TLV758P

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Undervoltage Lockout (UVLO)
      2. 6.3.2 Shutdown
      3. 6.3.3 Foldback Current Limit
      4. 6.3.4 Thermal Shutdown
    4. 6.4 Device Functional Modes
      1. 6.4.1 Device Functional Mode Comparison
      2. 6.4.2 Normal Operation
      3. 6.4.3 Dropout Operation
      4. 6.4.4 Disabled
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Adjustable Device Feedback Resistors
      2. 7.1.2 Input and Output Capacitor Selection
      3. 7.1.3 Dropout Voltage
      4. 7.1.4 Exiting Dropout
      5. 7.1.5 Reverse Current
      6. 7.1.6 Power Dissipation (PD)
      7. 7.1.7 Feed-Forward Capacitor (CFF)
      8. 7.1.8 Start-Up Sequencing
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 Input Current
        2. 7.2.2.2 Thermal Dissipation
      3. 7.2.3 Application Curve
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Examples
  9. 8 Device and Documentation Support
    1. 8.1 Documentation Support
      1. 8.1.1 Device Nomenclature
      2. 8.1.2 Related Documentation
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

3 Description

The TLV758P is an adjustable 500-mA low-dropout (LDO) regulator . This device is available in a small, 6-pin, 2-mm × 2-mm WSON package and a 5-pin SOT23 package and consumes very low quiescent current and provides fast line and load transient performance. The TLV758P features an ultra-low dropout of 130 mV at 500 mA that can help improve the power efficiency of the system.

The TLV758P is optimized for a wide variety of applications by supporting an input voltage range from 1.5 V to 6.0 V and an externally adjustable output range of 0.55 V to 5.5 V. The low output voltage enables this LDO to power the modern microcontrollers with lower core voltages.

The TLV758P is stable with small ceramic output capacitors, allowing for a small overall solution size. A precision band-gap and error amplifier provides high accuracy of 0.7% (max) at 25°C and 1% (max) over temperature (85°C). This device includes integrated thermal shutdown, current limit, and undervoltage lockout (UVLO) features. The TLV758P has an internal foldback current limit that helps reduce the thermal dissipation during short-circuit events.

Package Information
PART NUMBER PACKAGE(1) PACKAGE SIZE(2)
TLV758P DRV (WSON, 6) 2 mm × 2 mm
DBV (SOT-23, 5) 2.9 mm × 2.8 mm
(1) For all available packages, see the orderable addendum at the end of the data sheet.
(2) The package size (length × width) is a nominal value and includes pins, where applicable.

 

 

 

GUID-97DFC30B-17D3-4169-A372-676E13557D27-low.gif Typical Application