SBVS351D
April 2018 – October 2023
TLV758P
PRODUCTION DATA
1
1
Features
2
Applications
3
Description
4
Pin Configuration and Functions
5
Specifications
5.1
Absolute Maximum Ratings
5.2
ESD Ratings
5.3
Recommended Operating Conditions
5.4
Thermal Information
5.5
Electrical Characteristics
5.6
Typical Characteristics
6
Detailed Description
6.1
Overview
6.2
Functional Block Diagram
6.3
Feature Description
6.3.1
Undervoltage Lockout (UVLO)
6.3.2
Shutdown
6.3.3
Foldback Current Limit
6.3.4
Thermal Shutdown
6.4
Device Functional Modes
6.4.1
Device Functional Mode Comparison
6.4.2
Normal Operation
6.4.3
Dropout Operation
6.4.4
Disabled
7
Application and Implementation
7.1
Application Information
7.1.1
Adjustable Device Feedback Resistors
7.1.2
Input and Output Capacitor Selection
7.1.3
Dropout Voltage
7.1.4
Exiting Dropout
7.1.5
Reverse Current
7.1.6
Power Dissipation (PD)
7.1.7
Feed-Forward Capacitor (CFF)
7.1.8
Start-Up Sequencing
7.2
Typical Application
7.2.1
Design Requirements
7.2.2
Detailed Design Procedure
7.2.2.1
Input Current
7.2.2.2
Thermal Dissipation
7.2.3
Application Curve
7.3
Power Supply Recommendations
7.4
Layout
7.4.1
Layout Guidelines
7.4.2
Layout Examples
8
Device and Documentation Support
8.1
Documentation Support
8.1.1
Device Nomenclature
8.1.2
Related Documentation
8.2
Receiving Notification of Documentation Updates
8.3
Support Resources
8.4
Trademarks
8.5
Electrostatic Discharge Caution
8.6
Glossary
9
Revision History
10
Mechanical, Packaging, and Orderable Information
Package Options
Mechanical Data (Package|Pins)
DRV|6
MPDS216E
DBV|5
MPDS018T
Thermal pad, mechanical data (Package|Pins)
DRV|6
QFND087M
Orderable Information
sbvs351d_oa
sbvs351d_pm
8.6
Glossary
TI Glossary
This glossary lists and explains terms, acronyms, and definitions.