SNVSAV1A June   2017  – October 2017 TLV760

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Thermal Protection
      2. 7.3.2 Dropout Voltage
    4. 7.4 Device Functional Modes
      1. 7.4.1 Normal Operation
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Fixed Output
      2. 8.1.2 External Capacitors
        1. 8.1.2.1 Input and Output Capacitor Requirements
        2. 8.1.2.2 Load-Step Transient Response
      3. 8.1.3 Power Dissipation
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Related Documentation
      2. 11.1.2 Spice Models
      3. 11.1.3 Device Nomenclature
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

10 Layout

10.1 Layout Guidelines

General guidelines for linear regulator designs are to place all circuit components on the same side of the circuit board and as near as practical to the respective TLV760 pin connections. Place ground return connections to the input and output capacitors, and to the TLV760 ground pin as close as possible to each other, connected by a wide, component-side, copper surface. The use of vias and long traces to create TLV760 circuit connections is strongly discouraged and negatively affects system performance.

Use a ground reference plane, either embedded in the PCB itself or located on the bottom side of the PCB opposite the components. This reference plane serves to assure accuracy of the output voltage and to shield noise; it behaves similarly to a thermal plane to spread heat from the linear regulator. In most applications, this ground plane is necessary to meet thermal requirements.

10.2 Layout Example

TLV760 Layout-DBZ.gif Figure 25. Layout Guideline for TLV760