SNVSAV1A June   2017  – October 2017 TLV760

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Thermal Protection
      2. 7.3.2 Dropout Voltage
    4. 7.4 Device Functional Modes
      1. 7.4.1 Normal Operation
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Fixed Output
      2. 8.1.2 External Capacitors
        1. 8.1.2.1 Input and Output Capacitor Requirements
        2. 8.1.2.2 Load-Step Transient Response
      3. 8.1.3 Power Dissipation
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Related Documentation
      2. 11.1.2 Spice Models
      3. 11.1.3 Device Nomenclature
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6 Specifications

6.1 Absolute Maximum Ratings(1)

MIN MAX UNIT
Input voltage (IN to GND) –0.3 35 V
Output Voltage (OUT) VIN + 0.3 V
Output Current Internally limited(2) mA
Junction temperature –40 150 °C
Storage temperature, Tstg −65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) See Recommended Operating Conditions section for more details.

6.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V
Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±500
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
Maximum input voltage (IN to GND) 30 V
Output current (IOUT) 100 mA
Input and output capacitor (COUT) 0.1 µF
Junction temperature, TJ –40 125 °C

6.4 Thermal Information

THERMAL METRIC(1) TLV760 UNIT
DBZ (SOT-23)
3 PINS
RθJA Junction-to-ambient thermal resistance 275.2 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 92.8 °C/W
RθJB Junction-to-board thermal resistance 56.8 °C/W
ψJT Junction-to-top characterization parameter 2.9 °C/W
ψJB Junction-to-board characterization parameter 55.6 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.

6.5 Electrical Characteristics

Typical and other limits apply for TA = TJ = 25°C, VOUT(NOM) = 3.3 V, 5 V, 12 V, and 15 V, unless otherwise specified.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VOUT Output voltage accuracy VIN = VOUT(NOM)+ 1.5 V,
1 mA ≤ IOUT ≤ 100 mA		 –4% 4% V
VIN = VOUT(NOM) + 1.5 V,
1 mA ≤ IOUT ≤ 100 mA,
−40°C ≤ TJ ≤ 125°C 		–5% 5%
ΔV(ΔVIN) Line regulation VOUT(NOM) + 1.5 V ≤ VIN ≤ 30 V
IOUT = 1 mA ,
−40°C ≤ TJ ≤ 125°C		 VOUT(NOM) = 3.3 V, 5 V 10 30 mV
VOUT(NOM) = 12 V, 15 V 14 45
ΔV(ΔIOUT) Load regulation VIN =VOUT(NOM) + 1.5 V ,
10 mA ≤ IOUT ≤ 100 mA,
−40°C ≤ TJ ≤ 125°C 		VOUT(NOM) = 3.3 V, 5 V 20 45 mV
VOUT(NOM) = 12 V, 15 V 45 80
IGND Ground pin current VOUT(NOM) + 1.5 V ≤ VIN ≤ 30 V, no load,
−40°C ≤ TJ ≤ 125°C 		2 5 mA
VDO Dropout voltage IOUT = 10 mA 0.7 0.9 V
IOUT = 10 mA , −40°C ≤ TJ ≤ 125°C 1
IOUT = 100 mA 0.9 1.1
IOUT = 100 mA, −40°C ≤ TJ ≤ 125°C 1.2
TSD Thermal shutdown temperature 150 °C

6.6 Typical Characteristics

Unless indicated otherwise, VIN = VNOM + 1.5 V, CIN = 0.1 µF, COUT = 0.1 µF, and TA = 25°C.
TLV760 10007019.png Figure 1. Dropout Voltage vs Load Current
TLV760 10007009.png Figure 3. Ground Pin Current vs Input Voltage
TLV760 10007021.png Figure 5. Ground Pin Current vs Load Current
TLV760 10007011.png Figure 7. Input Current vs Input Voltage
TLV760 10007013.png Figure 9. Output Voltage vs Input Voltage
TLV760 TLV760-waveform-01-snvsav1.png
Figure 11. Output Short-Circuit Current
TLV760 10007024.png Figure 13. Power Supply Rejection Ratio
TLV760 10007023.png Figure 15. DC Load Regulation
TLV760 D002_SNVSAV1.gif
CIN = 1 µF COUT = 0.1 µF VOUT = 3.3 V
Figure 17. Output Spectral Noise Density vs Frequency
TLV760 10007020.png Figure 2. Dropout Voltage vs Junction Temperature
TLV760 10007010.png Figure 4. Ground Pin Current vs Input Voltage
TLV760 10007022.png Figure 6. Ground Pin Current vs Junction Temperature
TLV760 10007012.png Figure 8. Input Current vs Input Voltage
TLV760 10007014.png Figure 10. Output Voltage vs Input Voltage
TLV760 TLV760-waveform-02-snvsav1.png
Figure 12. Output Short-Circuit Current
TLV760 10007025.png Figure 14. Power Supply Rejection Ratio
TLV760 D001_SNVSAV1.gif
VOUT(Red) = 3.3 V IOUT(Black) = 100 mA
Figure 16. Output Current vs Input Voltage