SBVS382A
December 2020 – March 2023
TLV766-Q1
PRODUCTION DATA
1
Features
2
Applications
3
Description
4
Revision History
5
Pin Configuration and Functions
6
Specifications
6.1
Absolute Maximum Ratings
6.2
ESD Ratings
6.3
Recommended Operating Conditions
6.4
Thermal Information
6.5
Electrical Characteristics
6.6
Typical Characteristics
7
Detailed Description
7.1
Overview
7.2
Functional Block Diagrams
7.3
Feature Description
7.3.1
Output Enable
7.3.2
Dropout Voltage
7.3.3
Foldback Current Limit
7.3.4
Undervoltage Lockout (UVLO)
7.3.5
Output Pulldown
7.3.6
Thermal Shutdown
7.4
Device Functional Modes
7.4.1
Device Functional Mode Comparison
7.4.2
Normal Operation
7.4.3
Dropout Operation
7.4.4
Disabled
8
Application and Implementation
8.1
Application Information
8.1.1
Adjustable Device Feedback Resistors
8.1.2
Recommended Capacitor Types
8.1.3
Input and Output Capacitor Requirements
8.1.4
Reverse Current
8.1.5
Feed-Forward Capacitor (CFF)
8.1.6
Power Dissipation (PD)
8.1.7
Estimating Junction Temperature
8.2
Typical Application
8.2.1
Design Requirements
8.2.2
Detailed Design Procedure
8.2.2.1
Transient Response
8.2.2.2
Choose Feedback Resistors
8.2.3
Application Curves
8.3
Power Supply Recommendations
8.4
Layout
8.4.1
Layout Guidelines
8.4.2
Layout Examples
9
Device and Documentation Support
9.1
Device Support
9.1.1
Device Nomenclature
9.2
Documentation Support
9.2.1
Related Documentation
9.3
Receiving Notification of Documentation Updates
9.4
Support Resources
9.5
Trademarks
9.6
Electrostatic Discharge Caution
9.7
Glossary
10
Mechanical, Packaging, and Orderable Information
Package Options
Mechanical Data (Package|Pins)
DRB|8
MPDS118K
Thermal pad, mechanical data (Package|Pins)
DRB|8
QFND619
Orderable Information
sbvs382a_oa
sbvs382a_pm
9.7
Glossary
TI Glossary
This glossary lists and explains terms, acronyms, and definitions.