SLVSE84D December   2017  – July 2021 TLV767

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
  7. 7 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagrams
    3. 8.3 Feature Description
      1. 8.3.1 Output Enable
      2. 8.3.2 Dropout Voltage
      3. 8.3.3 Foldback Current Limit
      4. 8.3.4 Undervoltage Lockout (UVLO)
      5. 8.3.5 Output Pulldown
      6. 8.3.6 Thermal Shutdown
    4. 8.4 Device Functional Modes
      1. 8.4.1 Device Functional Mode Comparison
      2. 8.4.2 Normal Operation
      3. 8.4.3 Dropout Operation
      4. 8.4.4 Disabled
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Adjustable Device Feedback Resistors
      2. 9.1.2 Recommended Capacitor Types
      3. 9.1.3 Input and Output Capacitor Requirements
      4. 9.1.4 Reverse Current
      5. 9.1.5 Feed-Forward Capacitor (CFF)
      6. 9.1.6 Power Dissipation (PD)
      7. 9.1.7 Estimating Junction Temperature
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Transient Response
        2. 9.2.2.2 Choose Feedback Resistors
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Examples
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Device Nomenclature
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 Receiving Notification of Documentation Updates
    4. 12.4 Support Resources
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 Glossary

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5 Pin Configuration and Functions

Figure 5-1 DRV Package (Adjustable), 6-Pin WSON,
Top View
GUID-44FBD98A-84AE-420F-8C4E-B7FFFCCDC822-low.gifFigure 5-3 DGN Package (Adjustable),
8-Pin HVSSOP, Top View
Figure 5-5 DBV Package (Fixed),
5-Pin SOT-23,Top View
Figure 5-2 DRV Package (Fixed), 6-Pin WSON,
Top View
GUID-7C664C76-1E6C-4DD6-B55A-31F36084D4BF-low.gifFigure 5-4 DGN Package (Fixed), 8-Pin HVSSOP, Top View
Table 5-1 Pin Functions
PIN I/O DESCRIPTION
NAME DRV
(Adj)		 DRV
(Fixed)		 DGN
(Adj)		 DGN
(Fixed)		 DBV
(Fixed)
EN 4 4 5 5 3 I Enable pin. Driving the enable pin high enables the device. Driving this pin low disables the device. High and low thresholds are listed in the Electrical Characteristics table. This pin has an internal pullup and can be left floating to enable the device or the pin can be connected to the input pin.
FB 2 — 2 — — I Feedback pin. Input to the control-loop error amplifier. This pin is used to set the output voltage of the device with the use of external resistors. Do not float this pin. For adjustable-voltage version devices only.
GND 3, 5 3, 5 4, 6 4, 6 2 — Ground pin. All ground pins must be grounded.
DNC — — — — 4 — Do not connect to a biased voltage. Tie this pin to ground or leave floating
IN 6 6 8 8 1 I Input pin. Use the recommended capacitor value as listed in the Recommended Operating Conditions table. Place the input capacitor as close to the IN and GND pins of the device as possible.
OUT 1 1 1 1 5 O Output pin. Use the recommended capacitor value as listed in the Recommended Operating Conditions table. Place the output capacitor as close to the OUT and GND pins of the device as possible.
SNS — 2 — 2 — I Output sense pin. Connect the SNS pin to the OUT pin, or to remotely sense the output voltage at the load, connect the SNS pin to the load. Do not float this pin. For fixed-voltage version devices only.
Thermal pad Pad Pad Pad Pad — — Exposed pad of the package. Connect this pad to ground or leave floating. Connect the thermal pad to a large-area ground plane for best thermal performance.