SLVSE84D December   2017  – July 2021 TLV767

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
  7. 7 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagrams
    3. 8.3 Feature Description
      1. 8.3.1 Output Enable
      2. 8.3.2 Dropout Voltage
      3. 8.3.3 Foldback Current Limit
      4. 8.3.4 Undervoltage Lockout (UVLO)
      5. 8.3.5 Output Pulldown
      6. 8.3.6 Thermal Shutdown
    4. 8.4 Device Functional Modes
      1. 8.4.1 Device Functional Mode Comparison
      2. 8.4.2 Normal Operation
      3. 8.4.3 Dropout Operation
      4. 8.4.4 Disabled
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Adjustable Device Feedback Resistors
      2. 9.1.2 Recommended Capacitor Types
      3. 9.1.3 Input and Output Capacitor Requirements
      4. 9.1.4 Reverse Current
      5. 9.1.5 Feed-Forward Capacitor (CFF)
      6. 9.1.6 Power Dissipation (PD)
      7. 9.1.7 Estimating Junction Temperature
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Transient Response
        2. 9.2.2.2 Choose Feedback Resistors
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Examples
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Device Nomenclature
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 Receiving Notification of Documentation Updates
    4. 12.4 Support Resources
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 Glossary

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.5 Electrical Characteristics

Specified at TJ = –40°C to 125°C, VIN = VOUT(nom) + 1.5 V or VIN = 2.5 V (whichever is greater), FB/SNS tied to OUT, IOUT = 10 mA, VEN = 2 V, CIN = 1.0 µF, COUT = 1.0 µF (unless otherwise noted). Typical values are at TJ= 25ºC.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VOUT Nominal output accuracy TJ = 25°C –0.5 0.5 %
VOUT Output accuracy over temperature VIN ≥ 3.0 V, 1 mA ≤ IOUT ≤ 1 A –1 1 %
2.5 V ≤ VIN < 3.0 V, 1 mA ≤ IOUT ≤ 800 mA –1 1
VFB Feedback voltage 0.8 V
VREF Internal reference (adjustable device) TJ = 25ºC –0.5 0.5 %
–1 1
IFB Feedback pin current VFB = 1 V 10 50 nA
ΔVOUT(ΔVIN) Line regulation(1) VOUT(NOM) +1.5 V ≤ VIN ≤ 16 V, IOUT = 10 mA 0.02 %/V
ΔVOUT(ΔIOUT) Load regulation 1 mA ≤ IOUT ≤ 1 A, VIN ≥ 3.0 V 0.1 0.5 %/A
1 mA ≤ IOUT ≤ 800 mA, 2.5 V ≤ VIN < 3.0 V 0.1 0.5
VDO Dropout voltage(2) VIN ≥ 3.0V, IOUT = 1 A, DGN package 0.9 1.5 V
VIN ≥ 3.0V, IOUT = 1 A, DRV package 0.9 1.4
2.5 V ≤ VIN < 3.0 V, IOUT = 800 mA 0.8 1.3
ICL Output current limit VOUT = 0.9 x VOUT(NOM) , VIN ≥ 3.0V 1.1 1.6 A
VOUT = 0.9 x VOUT(NOM), 2.5 V ≤ VIN < 3.0 V 0.81   1.6
ISC Short-circuit current limit VOUT = 0 V, DGN package 250 mA
VOUT = 0 V, DRV package 150 250 350 mA
IQ Quiescent current IOUT = 0 mA  50 80 µA
Fixed output devices, IOUT = 0 mA 60 95
IGND Ground current IOUT = 1 A, VIN ≥ 3.0 V 1.5 mA
ISHUTDOWN Shutdown current VEN ≤ 0.4 V, VIN = 16 V 1.5 3 µA
VEN(HIGH) Enable pin logic high 2.5 V ≤ VIN ≤ 16 V 1.2 V
VEN(LOW) Enable pin logic low 2.5 V ≤ VIN ≤ 16 V 0.4 V
IEN Enable pullup current VEN = 0 V 400 nA
IPULLDOWN Output pulldown current VIN = 16 V, VOUT = 2.5 V, VEN=0V 1.2 mA
PSRR Power-supply rejection ratio VIN = 3.3 V, VOUT = 1.8 V, IOUT = 300 mA, f = 120 Hz 70 dB
Vn Output noise voltage BW = 10 Hz to 100 kHz, VIN = 3.3 V, VOUT = 0.8 V, IOUT = 100 mA 60 µVRMS
VUVLO+ UVLO threshold rising VIN rising 2.2 2.4 V
VUVLO(HYS) UVLO hysteresis 130 mV
VUVLO- UVLO threshold falling VIN falling 1.9 V
TSD(shutdown) Thermal shutdown temperature Temperature increasing 180 ºC
TSD(reset) Thermal shutdown reset temperature Temperature falling 160 ºC
(1) Line regulation is measured with VIN = VOUT(NOM) + 1.5 V or 2.5 V (whichever is greater)
(2) VDO is measured with VIN = 95% x VOUT(nom) for fixed output devices. VDO is not measured for fixed output devices when VOUT < 2.5 V. For adjustable output device, VDO is measured with VFB = 95% x VFB(nom)