SBVS453 May   2024 TLV770

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Switching Characteristics
    7. 5.7 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Dropout Voltage
      2. 6.3.2 Active Discharge
      3. 6.3.3 Brick-Wall Current Limit
      4. 6.3.4 Thermal Shutdown
    4. 6.4 Device Functional Modes
      1. 6.4.1 Normal Operation
      2. 6.4.2 Dropout Operation
      3. 6.4.3 Disabled
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Recommended Capacitor Types
      2. 7.1.2 Input and Output Capacitor Requirements
    2. 7.2 Typical Application
      1. 7.2.1 Application
      2. 7.2.2 Design Requirements
      3. 7.2.3 Detailed Design Procedure
      4. 7.2.4 Application Curves
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Examples
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Device Nomenclature
    2. 8.2 Documentation Support
      1. 8.2.1 Related Documentation
    3. 8.3 Receiving Notification of Documentation Updates
    4. 8.4 Support Resources
    5. 8.5 Trademarks
    6. 8.6 Electrostatic Discharge Caution
    7. 8.7 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DBV|5
  • DQN|4
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Pin Configuration and Functions

TLV770 DQN Package,1mm × 1mm, 4-Pin X2SON(Top View)Figure 4-1 DQN Package,1mm × 1mm, 4-Pin X2SON(Top View)
TLV770 DBV Package,5-Pin SOT-23(Top View)Figure 4-2 DBV Package,5-Pin SOT-23(Top View)
Table 4-1 Pin Functions
PINTYPE(1)DESCRIPTION
NAMEX2SONSOT-23
EN33IEnable input. A low voltage (< VEN(LOW)) on this pin turns the regulator off and discharges the output pin to GND. A high voltage (> VEN(HI)) on this pin enables the regulator output.
GND22GCommon ground.
IN41IInput voltage supply. For best transient response and to minimize input impedance, use the nominal value or larger capacitor from IN to ground; see Section 5.3. Place the input capacitor as close to the IN and GND pins of the device as possible.
N/C—4—No internal electrical connection. Connect to GND for improved thermal performance.
OUT15ORegulated output voltage. A low equivalent series resistance (ESR) capacitor is required from OUT to ground for stability. For best transient response, use the nominal recommended value or larger capacitor, as listed in Section 5.3. Place the output capacitor as close to the OUT and GND pins of the device as possible. An internal pulldown resistor prevents a charge from remaining on VOUT when the regulator is in shutdown mode (VEN< VEN(LOW)).
Thermal Pad5——Thermal pad for the X2SON package. Connect this pad to GND or leave floating.
Do not connect to any potential other than GND. Connect the thermal pad to a large-area ground plane for best thermal performance.
(1) I = input, O = output, I/O = input or output, and G = ground.