SBVS453 May   2024 TLV770

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Switching Characteristics
    7. 5.7 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Dropout Voltage
      2. 6.3.2 Active Discharge
      3. 6.3.3 Brick-Wall Current Limit
      4. 6.3.4 Thermal Shutdown
    4. 6.4 Device Functional Modes
      1. 6.4.1 Normal Operation
      2. 6.4.2 Dropout Operation
      3. 6.4.3 Disabled
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Recommended Capacitor Types
      2. 7.1.2 Input and Output Capacitor Requirements
    2. 7.2 Typical Application
      1. 7.2.1 Application
      2. 7.2.2 Design Requirements
      3. 7.2.3 Detailed Design Procedure
      4. 7.2.4 Application Curves
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Examples
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Device Nomenclature
    2. 8.2 Documentation Support
      1. 8.2.1 Related Documentation
    3. 8.3 Receiving Notification of Documentation Updates
    4. 8.4 Support Resources
    5. 8.5 Trademarks
    6. 8.6 Electrostatic Discharge Caution
    7. 8.7 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DBV|5
  • DQN|4
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.7 Typical Characteristics

at operating temperature TJ = 25°C, VIN = VOUT(NOM) + 0.5V, IOUT = 1mA, VEN = VIN, and CIN = COUT = 1μF (unless otherwise noted)

TLV770 Line Regulation vs VIN
 
Figure 5-1 Line Regulation vs VIN
TLV770 Output Voltage Accuracy vs VIN
 
Figure 5-3 Output Voltage Accuracy vs VIN
TLV770 Dropout Voltage vs IOUT
 
Figure 5-5 Dropout Voltage vs IOUT
TLV770 Ground Current vs IOUT
 
Figure 5-7 Ground Current vs IOUT
TLV770 Current Limit
 
Figure 5-9 Current Limit
TLV770 Load Transient
VIN = VOUT(nom) + 1.0V, IOUT = 0mA to 50mA,
tRISING = 10µs
Figure 5-11 Load Transient
TLV770 Line Transient
VIN = VOUT + 0.3V to VOUT +1.3V
Figure 5-13 Line Transient
TLV770 Start-Up
 
Figure 5-15 Start-Up
TLV770 Load Regulation vs IOUT
 
Figure 5-2 Load Regulation vs IOUT
TLV770 Output Voltage Accuracy vs IOUT
 
Figure 5-4 Output Voltage Accuracy vs IOUT
TLV770 Quiescent Current vs VIN
 
Figure 5-6 Quiescent Current vs VIN
TLV770 Shutdown Current vs VIN
VEN = 0V
Figure 5-8 Shutdown Current vs VIN
TLV770 Enable Logic Threshold vs Temperature
 
Figure 5-10 Enable Logic Threshold vs Temperature
TLV770 Load Transient
VIN = VOUT(nom) + 1.0V, IOUT = 50mA to 0mA,
tFALLING = 10µs
Figure 5-12 Load Transient
TLV770 PSRR vs Frequency
VIN = VOUT(nom) + 1.0V
Figure 5-14 PSRR vs Frequency
TLV770 Noise
VIN = 4.3V, VOUT(nom) = 3.3V
Figure 5-16 Noise